TEM annealing study of normal grain growth in silver thin films

Normal grain growth in 80-nm-thick sputter-deposited Ag films was studied via in situ heating stage transmission electron microscopy. The as-deposited films with an initial grain size of 40–50 nm were held at a series of temperatures (one per specimen) below 250°C. A grain growth exponent n=3 from t...

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Veröffentlicht in:	Thin solid films 2000-12, Vol.379 (1), p.133-138
Hauptverfasser:	Dannenberg, Rand, Stach, Eric, Groza, Joanna R, Dresser, Brian J
Format:	Artikel
Sprache:	eng
Schlagworte:	ACTIVATION ENERGY ANNEALING Applied sciences Cold working, work hardening annealing, post-deformation annealing, quenching, tempering recovery, and crystallization Cold working, work hardening annealing, quenching, tempering, recovery, and recrystallization textures Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology DIFFUSION Exact sciences and technology Grain boundary GRAIN GROWTH GRAIN SIZE Growth mechanism HEATING in-situ transmission electron microscopy grain growth thin films MATERIALS SCIENCE Metals. Metallurgy Physics SILVER Sputtering Structure and morphology thickness Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology THIN FILMS TRANSMISSION ELECTRON MICROSCOPY TRANSPORT Treatment of materials and its effects on microstructure and properties
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