X-ray microdiffraction: local stress distributions in polycrystalline and epitaxial thin films
When investigated by X-ray microdiffraction, the stress states in thin metal films are found to be more complex than as assumed by the simple models that have been formulated to describe their behavior. In this paper, the local differences in stress have been measured in a polycrystalline Al(0.5 wt%...
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| Veröffentlicht in: | Microelectronic engineering 2004-07, Vol.75 (1), p.117-126 |
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| container_title | Microelectronic engineering |
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| creator | Phillips, M.A Spolenak, R Tamura, N Brown, W.L MacDowell, A.A Celestre, R.S Padmore, H.A Batterman, B.W Arzt, E Patel, J.R |
| description | When investigated by X-ray microdiffraction, the stress states in thin metal films are found to be more complex than as assumed by the simple models that have been formulated to describe their behavior. In this paper, the local differences in stress have been measured in a polycrystalline Al(0.5 wt% Cu) film on Si and an epitaxial Cu film on Al
2O
3. Significant differences in stress state are apparent between grains, but also within grains. While both types of film display a local variation in residual stress state, the width of the distribution is much broader in the polycrystalline film. The reasons for this are discussed in terms of grain size distribution and dislocation nucleation. |
| doi_str_mv | 10.1016/j.mee.2003.12.053 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_osti_</sourceid><recordid>TN_cdi_osti_scitechconnect_837410</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0167931704000590</els_id><sourcerecordid>29810964</sourcerecordid><originalsourceid>FETCH-LOGICAL-c382t-d2e4f69a25337b53b769285615ee45a8d803c4d74af6f4c148f0fce5cca1bcb63</originalsourceid><addsrcrecordid>eNp9kE1v1DAQhi0EUpfCD-gtHOCW4M_EgROqgFaqxIVKPWE5zlidleMsthd1_z2OthI3Th5rnndm9BByxWjHKOs_7rsFoOOUio7xjirxguyYHkSrVK9fkl1lhnYUbLggr3Pe0_qXVO_Ir4c22VOzoEvrjN4n6wqu8VMTVmdDk0uCnJsZa4HTcWvlBmNzWMPJpVMuNgSM0Ng4N3DAYp-wpspjRTyGJb8hr7wNGd4-v5fk_tvXn9c37d2P77fXX-5aJzQv7cxB-n60XAkxTEpMQz9yrXqmAKSyetZUODkP0vreS8ek9tQ7UM5ZNrmpF5fk3Xnumgua7LCAe3RrjOCK0WKQjFbmw5k5pPX3EXIxC2YHIdgI6zEbPmpGx15WkJ3B6iTnBN4cEi42nQyjZrNt9qbaNpttw7iptmvm_fNwm6u46jE6zP-CSo-CD7xyn88cVBt_ENJ2LEQHM6bt1nnF_2z5CzAcllA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>29810964</pqid></control><display><type>article</type><title>X-ray microdiffraction: local stress distributions in polycrystalline and epitaxial thin films</title><source>Elsevier ScienceDirect Journals</source><creator>Phillips, M.A ; Spolenak, R ; Tamura, N ; Brown, W.L ; MacDowell, A.A ; Celestre, R.S ; Padmore, H.A ; Batterman, B.W ; Arzt, E ; Patel, J.R</creator><creatorcontrib>Phillips, M.A ; Spolenak, R ; Tamura, N ; Brown, W.L ; MacDowell, A.A ; Celestre, R.S ; Padmore, H.A ; Batterman, B.W ; Arzt, E ; Patel, J.R ; Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)</creatorcontrib><description>When investigated by X-ray microdiffraction, the stress states in thin metal films are found to be more complex than as assumed by the simple models that have been formulated to describe their behavior. In this paper, the local differences in stress have been measured in a polycrystalline Al(0.5 wt% Cu) film on Si and an epitaxial Cu film on Al
2O
3. Significant differences in stress state are apparent between grains, but also within grains. While both types of film display a local variation in residual stress state, the width of the distribution is much broader in the polycrystalline film. The reasons for this are discussed in terms of grain size distribution and dislocation nucleation.</description><identifier>ISSN: 0167-9317</identifier><identifier>EISSN: 1873-5568</identifier><identifier>DOI: 10.1016/j.mee.2003.12.053</identifier><identifier>CODEN: MIENEF</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Al–Cu ; Applied sciences ; DISLOCATIONS ; DISTRIBUTION ; Electronics ; Exact sciences and technology ; GRAIN SIZE ; Materials ; MATERIALS SCIENCE ; Microdiffraction ; Microelectronic fabrication (materials and surfaces technology) ; NUCLEATION ; Plasticity ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Size effects ; Stress measurement ; Synchrotron ; Testing, measurement, noise and reliability ; THIN FILMS ; X-RAY MICRODIFFRACTION STRESS ANALYSIS THIN FILM</subject><ispartof>Microelectronic engineering, 2004-07, Vol.75 (1), p.117-126</ispartof><rights>2004 Elsevier B.V.</rights><rights>2004 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c382t-d2e4f69a25337b53b769285615ee45a8d803c4d74af6f4c148f0fce5cca1bcb63</citedby><cites>FETCH-LOGICAL-c382t-d2e4f69a25337b53b769285615ee45a8d803c4d74af6f4c148f0fce5cca1bcb63</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0167931704000590$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>230,309,310,314,776,780,785,786,881,3536,23910,23911,25119,27903,27904,65309</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=15893272$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://www.osti.gov/biblio/837410$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Phillips, M.A</creatorcontrib><creatorcontrib>Spolenak, R</creatorcontrib><creatorcontrib>Tamura, N</creatorcontrib><creatorcontrib>Brown, W.L</creatorcontrib><creatorcontrib>MacDowell, A.A</creatorcontrib><creatorcontrib>Celestre, R.S</creatorcontrib><creatorcontrib>Padmore, H.A</creatorcontrib><creatorcontrib>Batterman, B.W</creatorcontrib><creatorcontrib>Arzt, E</creatorcontrib><creatorcontrib>Patel, J.R</creatorcontrib><creatorcontrib>Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)</creatorcontrib><title>X-ray microdiffraction: local stress distributions in polycrystalline and epitaxial thin films</title><title>Microelectronic engineering</title><description>When investigated by X-ray microdiffraction, the stress states in thin metal films are found to be more complex than as assumed by the simple models that have been formulated to describe their behavior. In this paper, the local differences in stress have been measured in a polycrystalline Al(0.5 wt% Cu) film on Si and an epitaxial Cu film on Al
2O
3. Significant differences in stress state are apparent between grains, but also within grains. While both types of film display a local variation in residual stress state, the width of the distribution is much broader in the polycrystalline film. The reasons for this are discussed in terms of grain size distribution and dislocation nucleation.</description><subject>Al–Cu</subject><subject>Applied sciences</subject><subject>DISLOCATIONS</subject><subject>DISTRIBUTION</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>GRAIN SIZE</subject><subject>Materials</subject><subject>MATERIALS SCIENCE</subject><subject>Microdiffraction</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>NUCLEATION</subject><subject>Plasticity</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Size effects</subject><subject>Stress measurement</subject><subject>Synchrotron</subject><subject>Testing, measurement, noise and reliability</subject><subject>THIN FILMS</subject><subject>X-RAY MICRODIFFRACTION STRESS ANALYSIS THIN FILM</subject><issn>0167-9317</issn><issn>1873-5568</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNp9kE1v1DAQhi0EUpfCD-gtHOCW4M_EgROqgFaqxIVKPWE5zlidleMsthd1_z2OthI3Th5rnndm9BByxWjHKOs_7rsFoOOUio7xjirxguyYHkSrVK9fkl1lhnYUbLggr3Pe0_qXVO_Ir4c22VOzoEvrjN4n6wqu8VMTVmdDk0uCnJsZa4HTcWvlBmNzWMPJpVMuNgSM0Ng4N3DAYp-wpspjRTyGJb8hr7wNGd4-v5fk_tvXn9c37d2P77fXX-5aJzQv7cxB-n60XAkxTEpMQz9yrXqmAKSyetZUODkP0vreS8ek9tQ7UM5ZNrmpF5fk3Xnumgua7LCAe3RrjOCK0WKQjFbmw5k5pPX3EXIxC2YHIdgI6zEbPmpGx15WkJ3B6iTnBN4cEi42nQyjZrNt9qbaNpttw7iptmvm_fNwm6u46jE6zP-CSo-CD7xyn88cVBt_ENJ2LEQHM6bt1nnF_2z5CzAcllA</recordid><startdate>20040701</startdate><enddate>20040701</enddate><creator>Phillips, M.A</creator><creator>Spolenak, R</creator><creator>Tamura, N</creator><creator>Brown, W.L</creator><creator>MacDowell, A.A</creator><creator>Celestre, R.S</creator><creator>Padmore, H.A</creator><creator>Batterman, B.W</creator><creator>Arzt, E</creator><creator>Patel, J.R</creator><general>Elsevier B.V</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7SP</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope><scope>OTOTI</scope></search><sort><creationdate>20040701</creationdate><title>X-ray microdiffraction: local stress distributions in polycrystalline and epitaxial thin films</title><author>Phillips, M.A ; Spolenak, R ; Tamura, N ; Brown, W.L ; MacDowell, A.A ; Celestre, R.S ; Padmore, H.A ; Batterman, B.W ; Arzt, E ; Patel, J.R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c382t-d2e4f69a25337b53b769285615ee45a8d803c4d74af6f4c148f0fce5cca1bcb63</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Al–Cu</topic><topic>Applied sciences</topic><topic>DISLOCATIONS</topic><topic>DISTRIBUTION</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>GRAIN SIZE</topic><topic>Materials</topic><topic>MATERIALS SCIENCE</topic><topic>Microdiffraction</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>NUCLEATION</topic><topic>Plasticity</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Size effects</topic><topic>Stress measurement</topic><topic>Synchrotron</topic><topic>Testing, measurement, noise and reliability</topic><topic>THIN FILMS</topic><topic>X-RAY MICRODIFFRACTION STRESS ANALYSIS THIN FILM</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Phillips, M.A</creatorcontrib><creatorcontrib>Spolenak, R</creatorcontrib><creatorcontrib>Tamura, N</creatorcontrib><creatorcontrib>Brown, W.L</creatorcontrib><creatorcontrib>MacDowell, A.A</creatorcontrib><creatorcontrib>Celestre, R.S</creatorcontrib><creatorcontrib>Padmore, H.A</creatorcontrib><creatorcontrib>Batterman, B.W</creatorcontrib><creatorcontrib>Arzt, E</creatorcontrib><creatorcontrib>Patel, J.R</creatorcontrib><creatorcontrib>Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>OSTI.GOV</collection><jtitle>Microelectronic engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Phillips, M.A</au><au>Spolenak, R</au><au>Tamura, N</au><au>Brown, W.L</au><au>MacDowell, A.A</au><au>Celestre, R.S</au><au>Padmore, H.A</au><au>Batterman, B.W</au><au>Arzt, E</au><au>Patel, J.R</au><aucorp>Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)</aucorp><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>X-ray microdiffraction: local stress distributions in polycrystalline and epitaxial thin films</atitle><jtitle>Microelectronic engineering</jtitle><date>2004-07-01</date><risdate>2004</risdate><volume>75</volume><issue>1</issue><spage>117</spage><epage>126</epage><pages>117-126</pages><issn>0167-9317</issn><eissn>1873-5568</eissn><coden>MIENEF</coden><abstract>When investigated by X-ray microdiffraction, the stress states in thin metal films are found to be more complex than as assumed by the simple models that have been formulated to describe their behavior. In this paper, the local differences in stress have been measured in a polycrystalline Al(0.5 wt% Cu) film on Si and an epitaxial Cu film on Al
2O
3. Significant differences in stress state are apparent between grains, but also within grains. While both types of film display a local variation in residual stress state, the width of the distribution is much broader in the polycrystalline film. The reasons for this are discussed in terms of grain size distribution and dislocation nucleation.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.mee.2003.12.053</doi><tpages>10</tpages></addata></record> |
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| source | Elsevier ScienceDirect Journals |
| subjects | Al–Cu Applied sciences DISLOCATIONS DISTRIBUTION Electronics Exact sciences and technology GRAIN SIZE Materials MATERIALS SCIENCE Microdiffraction Microelectronic fabrication (materials and surfaces technology) NUCLEATION Plasticity Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Size effects Stress measurement Synchrotron Testing, measurement, noise and reliability THIN FILMS X-RAY MICRODIFFRACTION STRESS ANALYSIS THIN FILM |
| title | X-ray microdiffraction: local stress distributions in polycrystalline and epitaxial thin films |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T01%3A33%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_osti_&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=X-ray%20microdiffraction:%20local%20stress%20distributions%20in%20polycrystalline%20and%20epitaxial%20thin%20films&rft.jtitle=Microelectronic%20engineering&rft.au=Phillips,%20M.A&rft.aucorp=Lawrence%20Berkeley%20National%20Lab.%20(LBNL),%20Berkeley,%20CA%20(United%20States)&rft.date=2004-07-01&rft.volume=75&rft.issue=1&rft.spage=117&rft.epage=126&rft.pages=117-126&rft.issn=0167-9317&rft.eissn=1873-5568&rft.coden=MIENEF&rft_id=info:doi/10.1016/j.mee.2003.12.053&rft_dat=%3Cproquest_osti_%3E29810964%3C/proquest_osti_%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=29810964&rft_id=info:pmid/&rft_els_id=S0167931704000590&rfr_iscdi=true |