Simple Technique for Observing Subsurface Damage in Machining of Ceramics
A simple technique is proposed for directly observing subsurface damage in the machining of ceramics. The technique requires two polished specimens and an optical microscope with Nomarski illumination for examination. The subsurface damage created by the grinding of an alumina ceramic is investigate...
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| Veröffentlicht in: | Journal of the American Ceramic Society 1994-05, Vol.77 (5), p.1388-1390 |
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| container_title | Journal of the American Ceramic Society |
| container_volume | 77 |
| creator | Xu, Hockin H. K. Jahanmir, Said |
| description | A simple technique is proposed for directly observing subsurface damage in the machining of ceramics. The technique requires two polished specimens and an optical microscope with Nomarski illumination for examination. The subsurface damage created by the grinding of an alumina ceramic is investigated using this technique. The mode of damage is identified as intragrain twinning/slip, and intergranular and transgranular cracking. Chipping along the twinned planes and along the transgranular crack planes, and dislodgement of the intergranularly debonded grains are suggested to be the mechanisms of material removal in the machining of this alumina ceramic. |
| doi_str_mv | 10.1111/j.1151-2916.1994.tb05424.x |
| format | Article |
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Glasses</topic><topic>Ceramic industries</topic><topic>CERAMICS</topic><topic>CHALCOGENIDES</topic><topic>Chemical industry and chemicals</topic><topic>CRACK PROPAGATION</topic><topic>Cracks</topic><topic>DAMAGE</topic><topic>Exact sciences and technology</topic><topic>General studies</topic><topic>Grinding (machining)</topic><topic>Interfaces (materials)</topic><topic>MACHINING</topic><topic>MATERIALS SCIENCE</topic><topic>Microscopic examination</topic><topic>OXIDES</topic><topic>OXYGEN COMPOUNDS</topic><topic>Scanning electron microscopy</topic><topic>Surfaces</topic><topic>Technical ceramics</topic><topic>TWINNING</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Xu, Hockin H. 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K.</au><au>Jahanmir, Said</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Simple Technique for Observing Subsurface Damage in Machining of Ceramics</atitle><jtitle>Journal of the American Ceramic Society</jtitle><date>1994-05</date><risdate>1994</risdate><volume>77</volume><issue>5</issue><spage>1388</spage><epage>1390</epage><pages>1388-1390</pages><issn>0002-7820</issn><eissn>1551-2916</eissn><coden>JACTAW</coden><abstract>A simple technique is proposed for directly observing subsurface damage in the machining of ceramics. The technique requires two polished specimens and an optical microscope with Nomarski illumination for examination. The subsurface damage created by the grinding of an alumina ceramic is investigated using this technique. The mode of damage is identified as intragrain twinning/slip, and intergranular and transgranular cracking. 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| identifier | ISSN: 0002-7820 |
| ispartof | Journal of the American Ceramic Society, 1994-05, Vol.77 (5), p.1388-1390 |
| issn | 0002-7820 1551-2916 |
| language | eng |
| recordid | cdi_osti_scitechconnect_7045394 |
| source | Wiley Online Library Journals Frontfile Complete |
| subjects | 360201 - Ceramics, Cermets, & Refractories- Preparation & Fabrication Alumina ALUMINIUM COMPOUNDS ALUMINIUM OXIDES Applied sciences Building materials. Ceramics. Glasses Ceramic industries CERAMICS CHALCOGENIDES Chemical industry and chemicals CRACK PROPAGATION Cracks DAMAGE Exact sciences and technology General studies Grinding (machining) Interfaces (materials) MACHINING MATERIALS SCIENCE Microscopic examination OXIDES OXYGEN COMPOUNDS Scanning electron microscopy Surfaces Technical ceramics TWINNING |
| title | Simple Technique for Observing Subsurface Damage in Machining of Ceramics |
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