Electrical and structural changes in the near surface of reactively ion etched InP

Near-surface (∼1000 Å) modification in the net carrier concentration in n-type InP (n=6×1015–1.5×1017 cm−3) was observed after reactive ion etching (RIE) in Cl-based (CCl2F2/O2) or organic-based (C2H6/H2) discharges. The carrier loss is slightly more pronounced in the latter case, due possibly to th...

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Veröffentlicht in:Applied physics letters 1989-10, Vol.55 (16), p.1633-1635
Hauptverfasser: PEARTON, S. J, CHAKRABARTI, U. K, BAIOCCHI, F. A
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container_end_page 1635
container_issue 16
container_start_page 1633
container_title Applied physics letters
container_volume 55
creator PEARTON, S. J
CHAKRABARTI, U. K
BAIOCCHI, F. A
description Near-surface (∼1000 Å) modification in the net carrier concentration in n-type InP (n=6×1015–1.5×1017 cm−3) was observed after reactive ion etching (RIE) in Cl-based (CCl2F2/O2) or organic-based (C2H6/H2) discharges. The carrier loss is slightly more pronounced in the latter case, due possibly to the creation of deep level, compensating acceptors at greater depths as a result of implantation of the light hydrogen ions. Near-complete recovery of the initial carrier density occurs after annealing at 500 °C for 30 s. Structural disorder is detected by ion channeling to depths of ∼400 Å after C2H6/H2 RIE with a self-bias of 380 V. This disorder shows significant recovery after 400 °C, 30 s annealing. Current-voltage measurements on Au Schottky diodes showed ohmic behavior after etching of the InP in a C2H6/H2 discharge, due to the nonstoichiometric surface remaining after RIE. Diodes fabricated on CCl2F2/O2 etched material show only a slight increase in reverse current compared to unetched control samples.
doi_str_mv 10.1063/1.102221
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Current-voltage measurements on Au Schottky diodes showed ohmic behavior after etching of the InP in a C2H6/H2 discharge, due to the nonstoichiometric surface remaining after RIE. 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Current-voltage measurements on Au Schottky diodes showed ohmic behavior after etching of the InP in a C2H6/H2 discharge, due to the nonstoichiometric surface remaining after RIE. 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A</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electrical and structural changes in the near surface of reactively ion etched InP</atitle><jtitle>Applied physics letters</jtitle><date>1989-10-16</date><risdate>1989</risdate><volume>55</volume><issue>16</issue><spage>1633</spage><epage>1635</epage><pages>1633-1635</pages><issn>0003-6951</issn><eissn>1077-3118</eissn><coden>APPLAB</coden><abstract>Near-surface (∼1000 Å) modification in the net carrier concentration in n-type InP (n=6×1015–1.5×1017 cm−3) was observed after reactive ion etching (RIE) in Cl-based (CCl2F2/O2) or organic-based (C2H6/H2) discharges. The carrier loss is slightly more pronounced in the latter case, due possibly to the creation of deep level, compensating acceptors at greater depths as a result of implantation of the light hydrogen ions. Near-complete recovery of the initial carrier density occurs after annealing at 500 °C for 30 s. Structural disorder is detected by ion channeling to depths of ∼400 Å after C2H6/H2 RIE with a self-bias of 380 V. This disorder shows significant recovery after 400 °C, 30 s annealing. Current-voltage measurements on Au Schottky diodes showed ohmic behavior after etching of the InP in a C2H6/H2 discharge, due to the nonstoichiometric surface remaining after RIE. Diodes fabricated on CCl2F2/O2 etched material show only a slight increase in reverse current compared to unetched control samples.</abstract><cop>Melville, NY</cop><pub>American Institute of Physics</pub><doi>10.1063/1.102221</doi><tpages>3</tpages></addata></record>
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ispartof Applied physics letters, 1989-10, Vol.55 (16), p.1633-1635
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1077-3118
language eng
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source AIP Digital Archive
subjects 360605 - Materials- Radiation Effects
ANNEALING
BEAMS
CARRIER DENSITY
CHARGE CARRIERS
COLLISIONS
Condensed matter: electronic structure, electrical, magnetic, and optical properties
ELECTRIC DISCHARGES
ELECTRONIC STRUCTURE
Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures
ETCHING
Exact sciences and technology
FABRICATION
HEAT TREATMENTS
HIGH TEMPERATURE
IMPURITIES
INDIUM COMPOUNDS
INDIUM PHOSPHIDES
ION BEAMS
ION COLLISIONS
MATERIALS SCIENCE
PHOSPHIDES
PHOSPHORUS COMPOUNDS
PHYSICAL RADIATION EFFECTS
Physics
PNICTIDES
RADIATION EFFECTS
SCHOTTKY BARRIER DIODES
SEMICONDUCTOR DEVICES
SEMICONDUCTOR DIODES
Surface conductivity and carrier phenomena
SURFACE FINISHING
title Electrical and structural changes in the near surface of reactively ion etched InP
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