Breakdown characteristics analysis of kV-class vertical GaN PIN rectifiers by wafer-level sub-bandgap photoluminescence mapping

This work reports analysis of the reverse-bias breakdown characteristics of homojunction gallium nitride (GaN) p–i–n (PIN) rectifiers fabricated on bulk GaN substrates. Sub-bandgap photoluminescence mapping at room temperature as a contactless, non-destructive wafer inspection method was performed t...

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Veröffentlicht in:Journal of applied physics 2024-05, Vol.135 (20)
Hauptverfasser: Xu, Zhiyu, Daeumer, Matthias A., Cho, Minkyu, Yoo, Jae-Hyuck, Detchprohm, Theeradetch, Bakhtiary-Noodeh, Marzieh, Shao, Qinghui, Laurence, Ted A., Key, Daryl, Letts, Edward, Hashimoto, Tadao, Dupuis, Russell D., Shen, Shyh-Chiang
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container_issue 20
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container_title Journal of applied physics
container_volume 135
creator Xu, Zhiyu
Daeumer, Matthias A.
Cho, Minkyu
Yoo, Jae-Hyuck
Detchprohm, Theeradetch
Bakhtiary-Noodeh, Marzieh
Shao, Qinghui
Laurence, Ted A.
Key, Daryl
Letts, Edward
Hashimoto, Tadao
Dupuis, Russell D.
Shen, Shyh-Chiang
description This work reports analysis of the reverse-bias breakdown characteristics of homojunction gallium nitride (GaN) p–i–n (PIN) rectifiers fabricated on bulk GaN substrates. Sub-bandgap photoluminescence mapping at room temperature as a contactless, non-destructive wafer inspection method was performed to analyze the impact of material properties on grown GaN PIN diodes and to study the correlation between defect types and breakdown characteristics of vertical GaN PIN rectifiers. Under the sub-bandgap excitation, yellow luminescence is dominant. The premature breakdown characteristics of the fabricated kV-class vertical GaN PIN rectifiers with nitrogen-implanted floating guard rings are found to be associated with material defects and deep level complexes. Photoluminescence mapping has demonstrated its effectiveness in quantitative analysis of dislocations and other types of defects.
doi_str_mv 10.1063/5.0208578
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subjects Breakdown
Crystallographic defects
Defects
Energy gap
ENGINEERING
Epitaxy
Gallium nitrides
Homojunctions
Impact analysis
Mapping
Material properties
Nanotechnology
Nondestructive testing
Photoluminescence
PIN diode
PIN diodes
Rectifier
Rectifiers
Room temperature
Semiconductors
Substrates
title Breakdown characteristics analysis of kV-class vertical GaN PIN rectifiers by wafer-level sub-bandgap photoluminescence mapping
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