Thermoelectric and mechanical properties of spark plasma sintered Cu{sub 3}SbSe{sub 3} and Cu{sub 3}SbSe{sub 4}: Promising thermoelectric materials
We report the synthesis of thermoelectric compounds, Cu{sub 3}SbSe{sub 3} and Cu{sub 3}SbSe{sub 4}, employing the conventional fusion method followed by spark plasma sintering. Their thermoelectric properties indicated that despite its higher thermal conductivity, Cu{sub 3}SbSe{sub 4} exhibited a mu...
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| Veröffentlicht in: | Applied physics letters 2014-12, Vol.105 (26) |
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| container_title | Applied physics letters |
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| creator | Tyagi, Kriti Gahtori, Bhasker Bathula, Sivaiah Toutam, Vijaykumar Sharma, Sakshi Singh, Niraj Kumar Dhar, Ajay |
| description | We report the synthesis of thermoelectric compounds, Cu{sub 3}SbSe{sub 3} and Cu{sub 3}SbSe{sub 4}, employing the conventional fusion method followed by spark plasma sintering. Their thermoelectric properties indicated that despite its higher thermal conductivity, Cu{sub 3}SbSe{sub 4} exhibited a much larger value of thermoelectric figure-of-merit as compared to Cu{sub 3}SbSe{sub 3}, which is primarily due to its higher electrical conductivity. The thermoelectric compatibility factor of Cu{sub 3}SbSe{sub 4} was found to be ∼1.2 as compared to 0.2 V{sup −1} for Cu{sub 3}SbSe{sub 3} at 550 K. The results of the mechanical properties of these two compounds indicated that their microhardness and fracture toughness values were far superior to the other competing state-of-the-art thermoelectric materials. |
| doi_str_mv | 10.1063/1.4904996 |
| format | Article |
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Their thermoelectric properties indicated that despite its higher thermal conductivity, Cu{sub 3}SbSe{sub 4} exhibited a much larger value of thermoelectric figure-of-merit as compared to Cu{sub 3}SbSe{sub 3}, which is primarily due to its higher electrical conductivity. The thermoelectric compatibility factor of Cu{sub 3}SbSe{sub 4} was found to be ∼1.2 as compared to 0.2 V{sup −1} for Cu{sub 3}SbSe{sub 3} at 550 K. 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| identifier | ISSN: 0003-6951 |
| ispartof | Applied physics letters, 2014-12, Vol.105 (26) |
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| language | eng |
| recordid | cdi_osti_scitechconnect_22395606 |
| source | AIP Journals Complete; Alma/SFX Local Collection |
| subjects | ANTIMONIDES COMPARATIVE EVALUATIONS COMPATIBILITY CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY COPPER SELENIDES ELECTRIC CONDUCTIVITY FRACTURE PROPERTIES MICROHARDNESS PLASMA SINTERING SYNTHESIS THERMAL CONDUCTIVITY THERMOELECTRIC MATERIALS THERMOELECTRIC PROPERTIES |
| title | Thermoelectric and mechanical properties of spark plasma sintered Cu{sub 3}SbSe{sub 3} and Cu{sub 3}SbSe{sub 4}: Promising thermoelectric materials |
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