True Zero Degree Incident Implants on VIISta3000
The deliberate use of channeling to control depth profiles has come of age in the application to CMOS imaging sensor device manufacturing. In order to enable the true zero implant application on VIISta3000, we have optimized beam incidence angle control, using beam optics models and experimental mea...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Tagungsbericht |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | 1 |
container_start_page | |
container_title | |
container_volume | 1321 |
creator | Chang, Shengwu Chavva, Venkataramana Sinclair, Frank |
description | The deliberate use of channeling to control depth profiles has come of age in the application to CMOS imaging sensor device manufacturing. In order to enable the true zero implant application on VIISta3000, we have optimized beam incidence angle control, using beam optics models and experimental measurements. The experiment measurement and the beam optics analysis results agree, showing a variation of less than 0.03 degree (1 sigma ) across the wafer and from wafer to wafer. Achieving this accuracy in a manufacturing environment requires careful calibration and tight control of the collimator magnet and the mechanical scan system. In this paper we discuss the root cause of beam incidence angle variation on VIISta3000 and explain the calibration and optimization used to insure the consistent minimized beam incidence angle. We show experimental data, including ThermaWave and SIMS profiles. |
doi_str_mv | 10.1063/1.3548419 |
format | Conference Proceeding |
fullrecord | <record><control><sourceid>proquest_osti_</sourceid><recordid>TN_cdi_osti_scitechconnect_21510114</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1448717651</sourcerecordid><originalsourceid>FETCH-LOGICAL-o216t-fdadf4a91fd7a14af8f7b1a2741ab16e0de4829a773a66b3be328b66b32ff0d83</originalsourceid><addsrcrecordid>eNotTktLxDAYDD7AZe3BfxDw4qVrviRN0qOsrhYWPLiKeClp80Ur3WZt0v9vZZ3LDMyDIeQK2AqYErewEoU0EsoTsoCigFwrUKckK7VheraY0YqdkQVjpcy5FO8XJIvxm83QnItSLgjbjRPSDxwDvcfPEZFWQ9s5HBKt9ofeDinSMNC3qnpJVszFS3LubR8x--cled087NZP-fb5sVrfbfPAQaXcO-u8tCV4py1I643XDViuJdgGFDKH0vDSai2sUo1oUHDT_CnuPXNGLMn1cTfE1NWx7RK2X20YBmxTzaEABiDn1M0xdRjDz4Qx1fsuttjPxzFMsQYpjQatChC_1UdUNg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype><pqid>1448717651</pqid></control><display><type>conference_proceeding</type><title>True Zero Degree Incident Implants on VIISta3000</title><source>AIP Journals Complete</source><creator>Chang, Shengwu ; Chavva, Venkataramana ; Sinclair, Frank</creator><creatorcontrib>Chang, Shengwu ; Chavva, Venkataramana ; Sinclair, Frank</creatorcontrib><description>The deliberate use of channeling to control depth profiles has come of age in the application to CMOS imaging sensor device manufacturing. In order to enable the true zero implant application on VIISta3000, we have optimized beam incidence angle control, using beam optics models and experimental measurements. The experiment measurement and the beam optics analysis results agree, showing a variation of less than 0.03 degree (1 sigma ) across the wafer and from wafer to wafer. Achieving this accuracy in a manufacturing environment requires careful calibration and tight control of the collimator magnet and the mechanical scan system. In this paper we discuss the root cause of beam incidence angle variation on VIISta3000 and explain the calibration and optimization used to insure the consistent minimized beam incidence angle. We show experimental data, including ThermaWave and SIMS profiles.</description><identifier>ISSN: 0094-243X</identifier><identifier>ISBN: 9780735408760</identifier><identifier>ISBN: 0735408769</identifier><identifier>EISSN: 1551-7616</identifier><identifier>DOI: 10.1063/1.3548419</identifier><language>eng</language><publisher>United States</publisher><subject>ACCURACY ; BEAM OPTICS ; BEAMS ; CALIBRATION ; CHANNELING ; CHEMICAL ANALYSIS ; COLLIMATORS ; IMPLANTS ; INCIDENCE ANGLE ; ION BEAMS ; ION MICROPROBE ANALYSIS ; MAGNETS ; MANUFACTURING ; MASS SPECTROSCOPY ; MICROANALYSIS ; NONDESTRUCTIVE ANALYSIS ; OPTIMIZATION ; PARTICLE ACCELERATORS ; SENSORS ; SPECTROSCOPY</subject><ispartof>AIP conference proceedings, 2010, Vol.1321 (1)</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>230,314,776,780,881,27903,27904</link.rule.ids><backlink>$$Uhttps://www.osti.gov/biblio/21510114$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Chang, Shengwu</creatorcontrib><creatorcontrib>Chavva, Venkataramana</creatorcontrib><creatorcontrib>Sinclair, Frank</creatorcontrib><title>True Zero Degree Incident Implants on VIISta3000</title><title>AIP conference proceedings</title><description>The deliberate use of channeling to control depth profiles has come of age in the application to CMOS imaging sensor device manufacturing. In order to enable the true zero implant application on VIISta3000, we have optimized beam incidence angle control, using beam optics models and experimental measurements. The experiment measurement and the beam optics analysis results agree, showing a variation of less than 0.03 degree (1 sigma ) across the wafer and from wafer to wafer. Achieving this accuracy in a manufacturing environment requires careful calibration and tight control of the collimator magnet and the mechanical scan system. In this paper we discuss the root cause of beam incidence angle variation on VIISta3000 and explain the calibration and optimization used to insure the consistent minimized beam incidence angle. We show experimental data, including ThermaWave and SIMS profiles.</description><subject>ACCURACY</subject><subject>BEAM OPTICS</subject><subject>BEAMS</subject><subject>CALIBRATION</subject><subject>CHANNELING</subject><subject>CHEMICAL ANALYSIS</subject><subject>COLLIMATORS</subject><subject>IMPLANTS</subject><subject>INCIDENCE ANGLE</subject><subject>ION BEAMS</subject><subject>ION MICROPROBE ANALYSIS</subject><subject>MAGNETS</subject><subject>MANUFACTURING</subject><subject>MASS SPECTROSCOPY</subject><subject>MICROANALYSIS</subject><subject>NONDESTRUCTIVE ANALYSIS</subject><subject>OPTIMIZATION</subject><subject>PARTICLE ACCELERATORS</subject><subject>SENSORS</subject><subject>SPECTROSCOPY</subject><issn>0094-243X</issn><issn>1551-7616</issn><isbn>9780735408760</isbn><isbn>0735408769</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2010</creationdate><recordtype>conference_proceeding</recordtype><recordid>eNotTktLxDAYDD7AZe3BfxDw4qVrviRN0qOsrhYWPLiKeClp80Ur3WZt0v9vZZ3LDMyDIeQK2AqYErewEoU0EsoTsoCigFwrUKckK7VheraY0YqdkQVjpcy5FO8XJIvxm83QnItSLgjbjRPSDxwDvcfPEZFWQ9s5HBKt9ofeDinSMNC3qnpJVszFS3LubR8x--cled087NZP-fb5sVrfbfPAQaXcO-u8tCV4py1I643XDViuJdgGFDKH0vDSai2sUo1oUHDT_CnuPXNGLMn1cTfE1NWx7RK2X20YBmxTzaEABiDn1M0xdRjDz4Qx1fsuttjPxzFMsQYpjQatChC_1UdUNg</recordid><startdate>20100101</startdate><enddate>20100101</enddate><creator>Chang, Shengwu</creator><creator>Chavva, Venkataramana</creator><creator>Sinclair, Frank</creator><scope>7ST</scope><scope>C1K</scope><scope>SOI</scope><scope>OTOTI</scope></search><sort><creationdate>20100101</creationdate><title>True Zero Degree Incident Implants on VIISta3000</title><author>Chang, Shengwu ; Chavva, Venkataramana ; Sinclair, Frank</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-o216t-fdadf4a91fd7a14af8f7b1a2741ab16e0de4829a773a66b3be328b66b32ff0d83</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2010</creationdate><topic>ACCURACY</topic><topic>BEAM OPTICS</topic><topic>BEAMS</topic><topic>CALIBRATION</topic><topic>CHANNELING</topic><topic>CHEMICAL ANALYSIS</topic><topic>COLLIMATORS</topic><topic>IMPLANTS</topic><topic>INCIDENCE ANGLE</topic><topic>ION BEAMS</topic><topic>ION MICROPROBE ANALYSIS</topic><topic>MAGNETS</topic><topic>MANUFACTURING</topic><topic>MASS SPECTROSCOPY</topic><topic>MICROANALYSIS</topic><topic>NONDESTRUCTIVE ANALYSIS</topic><topic>OPTIMIZATION</topic><topic>PARTICLE ACCELERATORS</topic><topic>SENSORS</topic><topic>SPECTROSCOPY</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chang, Shengwu</creatorcontrib><creatorcontrib>Chavva, Venkataramana</creatorcontrib><creatorcontrib>Sinclair, Frank</creatorcontrib><collection>Environment Abstracts</collection><collection>Environmental Sciences and Pollution Management</collection><collection>Environment Abstracts</collection><collection>OSTI.GOV</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chang, Shengwu</au><au>Chavva, Venkataramana</au><au>Sinclair, Frank</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>True Zero Degree Incident Implants on VIISta3000</atitle><btitle>AIP conference proceedings</btitle><date>2010-01-01</date><risdate>2010</risdate><volume>1321</volume><issue>1</issue><issn>0094-243X</issn><eissn>1551-7616</eissn><isbn>9780735408760</isbn><isbn>0735408769</isbn><abstract>The deliberate use of channeling to control depth profiles has come of age in the application to CMOS imaging sensor device manufacturing. In order to enable the true zero implant application on VIISta3000, we have optimized beam incidence angle control, using beam optics models and experimental measurements. The experiment measurement and the beam optics analysis results agree, showing a variation of less than 0.03 degree (1 sigma ) across the wafer and from wafer to wafer. Achieving this accuracy in a manufacturing environment requires careful calibration and tight control of the collimator magnet and the mechanical scan system. In this paper we discuss the root cause of beam incidence angle variation on VIISta3000 and explain the calibration and optimization used to insure the consistent minimized beam incidence angle. We show experimental data, including ThermaWave and SIMS profiles.</abstract><cop>United States</cop><doi>10.1063/1.3548419</doi></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0094-243X |
ispartof | AIP conference proceedings, 2010, Vol.1321 (1) |
issn | 0094-243X 1551-7616 |
language | eng |
recordid | cdi_osti_scitechconnect_21510114 |
source | AIP Journals Complete |
subjects | ACCURACY BEAM OPTICS BEAMS CALIBRATION CHANNELING CHEMICAL ANALYSIS COLLIMATORS IMPLANTS INCIDENCE ANGLE ION BEAMS ION MICROPROBE ANALYSIS MAGNETS MANUFACTURING MASS SPECTROSCOPY MICROANALYSIS NONDESTRUCTIVE ANALYSIS OPTIMIZATION PARTICLE ACCELERATORS SENSORS SPECTROSCOPY |
title | True Zero Degree Incident Implants on VIISta3000 |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T18%3A28%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_osti_&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=True%20Zero%20Degree%20Incident%20Implants%20on%20VIISta3000&rft.btitle=AIP%20conference%20proceedings&rft.au=Chang,%20Shengwu&rft.date=2010-01-01&rft.volume=1321&rft.issue=1&rft.issn=0094-243X&rft.eissn=1551-7616&rft.isbn=9780735408760&rft.isbn_list=0735408769&rft_id=info:doi/10.1063/1.3548419&rft_dat=%3Cproquest_osti_%3E1448717651%3C/proquest_osti_%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1448717651&rft_id=info:pmid/&rfr_iscdi=true |