Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application
In this study, Si–30Al alloy was synthesized by the spray atomization and deposition technique. The microstructure and properties of the alloy were studied using optical microscopy, scanning electron microscopy, coefficient of thermal expansion (CTE) and thermal conductivity (TC) measurements, and 3...
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| Veröffentlicht in: | Materials characterization 2008-10, Vol.59 (10), p.1455-1457 |
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| creator | Wang, Feng Xiong, Baiqing Zhang, Yongan Zhu, Baohong Liu, Hongwei Wei, Yanguang |
| description | In this study, Si–30Al alloy was synthesized by the spray atomization and deposition technique. The microstructure and properties of the alloy were studied using optical microscopy, scanning electron microscopy, coefficient of thermal expansion (CTE) and thermal conductivity (TC) measurements, and 3-point bending tests. It was found that the microstructure of the alloy after hot pressing is composed of a continuous network of globular primary Si and interpenetrating secondary Al-rich phase. The property measurements results indicate that the spray-deposited 70Si30Al alloy has advantageous physical and mechanical characteristics, including low coefficient of thermal expansion (6.8
×
10
−
6
/K), high thermal conductivity (118 W/mK), low density (2.42 g cm
−
3
), high ultimate flexural strength (180 MPa) and Brinell hardness (261). |
| doi_str_mv | 10.1016/j.matchar.2008.01.012 |
| format | Article |
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×
10
−
6
/K), high thermal conductivity (118 W/mK), low density (2.42 g cm
−
3
), high ultimate flexural strength (180 MPa) and Brinell hardness (261).</description><identifier>ISSN: 1044-5803</identifier><identifier>EISSN: 1873-4189</identifier><identifier>DOI: 10.1016/j.matchar.2008.01.012</identifier><language>eng</language><publisher>United States: Elsevier Inc</publisher><subject>ALUMINIUM ALLOYS ; ATOMIZATION ; BENDING ; BRINELL HARDNESS ; FLEXURAL STRENGTH ; HOT PRESSING ; MATERIALS SCIENCE ; MICROSTRUCTURE ; OPTICAL MICROSCOPY ; PRESSURE RANGE MEGA PA 100-1000 ; Properties ; SCANNING ELECTRON MICROSCOPY ; SILICON ALLOYS ; Si–30Al alloy ; SPRAY COATING ; Spray-deposited ; THERMAL CONDUCTIVITY ; THERMAL EXPANSION</subject><ispartof>Materials characterization, 2008-10, Vol.59 (10), p.1455-1457</ispartof><rights>2008 Elsevier Inc.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c403t-339ece1b755f4813f5c1ff8d2b337a4828a80a1afa58229837977f2de78c83553</citedby><cites>FETCH-LOGICAL-c403t-339ece1b755f4813f5c1ff8d2b337a4828a80a1afa58229837977f2de78c83553</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.matchar.2008.01.012$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>230,314,780,784,885,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttps://www.osti.gov/biblio/21137466$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Wang, Feng</creatorcontrib><creatorcontrib>Xiong, Baiqing</creatorcontrib><creatorcontrib>Zhang, Yongan</creatorcontrib><creatorcontrib>Zhu, Baohong</creatorcontrib><creatorcontrib>Liu, Hongwei</creatorcontrib><creatorcontrib>Wei, Yanguang</creatorcontrib><title>Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application</title><title>Materials characterization</title><description>In this study, Si–30Al alloy was synthesized by the spray atomization and deposition technique. The microstructure and properties of the alloy were studied using optical microscopy, scanning electron microscopy, coefficient of thermal expansion (CTE) and thermal conductivity (TC) measurements, and 3-point bending tests. It was found that the microstructure of the alloy after hot pressing is composed of a continuous network of globular primary Si and interpenetrating secondary Al-rich phase. The property measurements results indicate that the spray-deposited 70Si30Al alloy has advantageous physical and mechanical characteristics, including low coefficient of thermal expansion (6.8
×
10
−
6
/K), high thermal conductivity (118 W/mK), low density (2.42 g cm
−
3
), high ultimate flexural strength (180 MPa) and Brinell hardness (261).</description><subject>ALUMINIUM ALLOYS</subject><subject>ATOMIZATION</subject><subject>BENDING</subject><subject>BRINELL HARDNESS</subject><subject>FLEXURAL STRENGTH</subject><subject>HOT PRESSING</subject><subject>MATERIALS SCIENCE</subject><subject>MICROSTRUCTURE</subject><subject>OPTICAL MICROSCOPY</subject><subject>PRESSURE RANGE MEGA PA 100-1000</subject><subject>Properties</subject><subject>SCANNING ELECTRON MICROSCOPY</subject><subject>SILICON ALLOYS</subject><subject>Si–30Al alloy</subject><subject>SPRAY COATING</subject><subject>Spray-deposited</subject><subject>THERMAL CONDUCTIVITY</subject><subject>THERMAL EXPANSION</subject><issn>1044-5803</issn><issn>1873-4189</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNqFUM1KAzEQXkTBWn0EIeDVrfnZbdKTlOIfKB7Uc0izkzZ1uwlJKvSmz-Ab-iRmbe_CwMzAfD_zFcU5wSOCyfhqNVqrpJcqjCjGYoRJLnpQDIjgrKyImBzmGVdVWQvMjouTGFcY47EgfFB8PVkdXExho9MmwCVKSwhrV_rlNlqtWqS6Bq0hs3d_qw_OQ0gWInIGRR_UtmzAu2gTNOjF_nx-MzzNsLZ1W2RcQNCCTsFlOPJKv6uF7RZIed9mvmRdd1ocGdVGONv3YfF2e_M6uy8fn-8eZtPHUleYpZKxCWggc17XphKEmVoTY0RD54xxVQkqlMCKKKNqQelEMD7h3NAGuNCC1TUbFhc73vytlVFnw3qpXddle5ISwng1HuerenfVpxIDGOmDXauwlQTLPm25kvu0ZZ-2xCQXzbjrHQ7yCx8WQq8AnYbGhl6gcfYfhl-wwI5e</recordid><startdate>20081001</startdate><enddate>20081001</enddate><creator>Wang, Feng</creator><creator>Xiong, Baiqing</creator><creator>Zhang, Yongan</creator><creator>Zhu, Baohong</creator><creator>Liu, Hongwei</creator><creator>Wei, Yanguang</creator><general>Elsevier Inc</general><scope>AAYXX</scope><scope>CITATION</scope><scope>OTOTI</scope></search><sort><creationdate>20081001</creationdate><title>Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application</title><author>Wang, Feng ; Xiong, Baiqing ; Zhang, Yongan ; Zhu, Baohong ; Liu, Hongwei ; Wei, Yanguang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c403t-339ece1b755f4813f5c1ff8d2b337a4828a80a1afa58229837977f2de78c83553</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>ALUMINIUM ALLOYS</topic><topic>ATOMIZATION</topic><topic>BENDING</topic><topic>BRINELL HARDNESS</topic><topic>FLEXURAL STRENGTH</topic><topic>HOT PRESSING</topic><topic>MATERIALS SCIENCE</topic><topic>MICROSTRUCTURE</topic><topic>OPTICAL MICROSCOPY</topic><topic>PRESSURE RANGE MEGA PA 100-1000</topic><topic>Properties</topic><topic>SCANNING ELECTRON MICROSCOPY</topic><topic>SILICON ALLOYS</topic><topic>Si–30Al alloy</topic><topic>SPRAY COATING</topic><topic>Spray-deposited</topic><topic>THERMAL CONDUCTIVITY</topic><topic>THERMAL EXPANSION</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Feng</creatorcontrib><creatorcontrib>Xiong, Baiqing</creatorcontrib><creatorcontrib>Zhang, Yongan</creatorcontrib><creatorcontrib>Zhu, Baohong</creatorcontrib><creatorcontrib>Liu, Hongwei</creatorcontrib><creatorcontrib>Wei, Yanguang</creatorcontrib><collection>CrossRef</collection><collection>OSTI.GOV</collection><jtitle>Materials characterization</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wang, Feng</au><au>Xiong, Baiqing</au><au>Zhang, Yongan</au><au>Zhu, Baohong</au><au>Liu, Hongwei</au><au>Wei, Yanguang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application</atitle><jtitle>Materials characterization</jtitle><date>2008-10-01</date><risdate>2008</risdate><volume>59</volume><issue>10</issue><spage>1455</spage><epage>1457</epage><pages>1455-1457</pages><issn>1044-5803</issn><eissn>1873-4189</eissn><abstract>In this study, Si–30Al alloy was synthesized by the spray atomization and deposition technique. The microstructure and properties of the alloy were studied using optical microscopy, scanning electron microscopy, coefficient of thermal expansion (CTE) and thermal conductivity (TC) measurements, and 3-point bending tests. It was found that the microstructure of the alloy after hot pressing is composed of a continuous network of globular primary Si and interpenetrating secondary Al-rich phase. The property measurements results indicate that the spray-deposited 70Si30Al alloy has advantageous physical and mechanical characteristics, including low coefficient of thermal expansion (6.8
×
10
−
6
/K), high thermal conductivity (118 W/mK), low density (2.42 g cm
−
3
), high ultimate flexural strength (180 MPa) and Brinell hardness (261).</abstract><cop>United States</cop><pub>Elsevier Inc</pub><doi>10.1016/j.matchar.2008.01.012</doi><tpages>3</tpages></addata></record> |
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| identifier | ISSN: 1044-5803 |
| ispartof | Materials characterization, 2008-10, Vol.59 (10), p.1455-1457 |
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| language | eng |
| recordid | cdi_osti_scitechconnect_21137466 |
| source | Elsevier ScienceDirect Journals Complete |
| subjects | ALUMINIUM ALLOYS ATOMIZATION BENDING BRINELL HARDNESS FLEXURAL STRENGTH HOT PRESSING MATERIALS SCIENCE MICROSTRUCTURE OPTICAL MICROSCOPY PRESSURE RANGE MEGA PA 100-1000 Properties SCANNING ELECTRON MICROSCOPY SILICON ALLOYS Si–30Al alloy SPRAY COATING Spray-deposited THERMAL CONDUCTIVITY THERMAL EXPANSION |
| title | Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application |
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