Direct Deposition of Crystalline Ta3N5 Thin Films on FTO for PEC Water Splitting
Tantalum nitride is a promising photoanode material for solar water splitting, but further study and practical use are constrained by the harsh conditions of the synthesis from Ta metal. Here, we report the direct deposition of crystalline Ta3N5 on fluorine-doped tin oxide (FTO) substrate via a cust...
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Veröffentlicht in: | ACS applied materials & interfaces 2019-05, Vol.11 (17), p.15457-15466 |
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creator | Hajibabaei, Hamed Little, Daniel J Pandey, Ayush Wang, Dunwei Mi, Zetian Hamann, Thomas W |
description | Tantalum nitride is a promising photoanode material for solar water splitting, but further study and practical use are constrained by the harsh conditions of the synthesis from Ta metal. Here, we report the direct deposition of crystalline Ta3N5 on fluorine-doped tin oxide (FTO) substrate via a custom-built atomic layer deposition (ALD) system. A combination of TaCl5 (Ta precursor) and ammonia (N source) was sequentially pulsed into the ALD reactor with the substrate heated to 550 °C to deposit compact and thin films of Ta3N5 with controllable thicknesses on FTO substrates. Importantly, it is shown that the FTO is chemically and structurally stable under the reducing conditions of ammonia at 550 °C. These electrodes produced an exceptional photocurrent onset potential of ∼0.3 V versus reversible hydrogen electrode (RHE) with a maximum photocurrent of ∼2.4 mA cm–2 at 1.23 V versus RHE. Results of photoelectrochemical investigations as a function of film thickness and illumination direction reveal that the performance of Ta3N5 is controlled by a hole diffusion length of ∼50 nm. These results are crucial for the successful integration of Ta3N5 in efficient unassisted water-splitting applications. |
doi_str_mv | 10.1021/acsami.8b21194 |
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Here, we report the direct deposition of crystalline Ta3N5 on fluorine-doped tin oxide (FTO) substrate via a custom-built atomic layer deposition (ALD) system. A combination of TaCl5 (Ta precursor) and ammonia (N source) was sequentially pulsed into the ALD reactor with the substrate heated to 550 °C to deposit compact and thin films of Ta3N5 with controllable thicknesses on FTO substrates. Importantly, it is shown that the FTO is chemically and structurally stable under the reducing conditions of ammonia at 550 °C. These electrodes produced an exceptional photocurrent onset potential of ∼0.3 V versus reversible hydrogen electrode (RHE) with a maximum photocurrent of ∼2.4 mA cm–2 at 1.23 V versus RHE. Results of photoelectrochemical investigations as a function of film thickness and illumination direction reveal that the performance of Ta3N5 is controlled by a hole diffusion length of ∼50 nm. 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Mater. Interfaces</addtitle><description>Tantalum nitride is a promising photoanode material for solar water splitting, but further study and practical use are constrained by the harsh conditions of the synthesis from Ta metal. Here, we report the direct deposition of crystalline Ta3N5 on fluorine-doped tin oxide (FTO) substrate via a custom-built atomic layer deposition (ALD) system. A combination of TaCl5 (Ta precursor) and ammonia (N source) was sequentially pulsed into the ALD reactor with the substrate heated to 550 °C to deposit compact and thin films of Ta3N5 with controllable thicknesses on FTO substrates. Importantly, it is shown that the FTO is chemically and structurally stable under the reducing conditions of ammonia at 550 °C. These electrodes produced an exceptional photocurrent onset potential of ∼0.3 V versus reversible hydrogen electrode (RHE) with a maximum photocurrent of ∼2.4 mA cm–2 at 1.23 V versus RHE. Results of photoelectrochemical investigations as a function of film thickness and illumination direction reveal that the performance of Ta3N5 is controlled by a hole diffusion length of ∼50 nm. 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Mater. Interfaces</addtitle><date>2019-05-01</date><risdate>2019</risdate><volume>11</volume><issue>17</issue><spage>15457</spage><epage>15466</epage><pages>15457-15466</pages><issn>1944-8244</issn><eissn>1944-8252</eissn><abstract>Tantalum nitride is a promising photoanode material for solar water splitting, but further study and practical use are constrained by the harsh conditions of the synthesis from Ta metal. Here, we report the direct deposition of crystalline Ta3N5 on fluorine-doped tin oxide (FTO) substrate via a custom-built atomic layer deposition (ALD) system. A combination of TaCl5 (Ta precursor) and ammonia (N source) was sequentially pulsed into the ALD reactor with the substrate heated to 550 °C to deposit compact and thin films of Ta3N5 with controllable thicknesses on FTO substrates. Importantly, it is shown that the FTO is chemically and structurally stable under the reducing conditions of ammonia at 550 °C. 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subjects | ALD atomic layer deposition CVD electrodes FTO INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY photoanode photonics Ta3N5 tantalum tantalum nitride water oxidation water splitting |
title | Direct Deposition of Crystalline Ta3N5 Thin Films on FTO for PEC Water Splitting |
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