Transient-Liquid-Phase Bonding of H230 Ni-Based Alloy Using Ni-P Interlayer: Microstructure and Mechanical Properties

Transient-liquid-phase bonding using Ni-P as an interlayer has been developed for H230 Ni-Cr-W solid-solution-strengthened Ni-based alloy. Two process parameters—composition of the interlayer and bonding time—have been varied to optimize the mechanical properties. H230 has been bonded into two sets...

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Veröffentlicht in:	Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2017-07, Vol.48 (7), p.3343-3356
Hauptverfasser:	Kapoor, Monica, Doğan, Ömer N., Carney, Casey S., Saranam, Rajesh V., McNeff, Patrick, Paul, Brian K.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Atom Probe Tomography Bonding strength Bonding Temperature Bonding Time Characterization and Evaluation of Materials Chemistry and Materials Science Chromium Ductile fracture Elongation Fracture surfaces Interlayers Joint Region Lamellar Microstructure Materials Science Mechanical properties Metallic Materials Metallurgy Microstructure Nanotechnology Nickel base alloys Plastic deformation Precipitates Process parameters SOLAR ENERGY Solid solutions Stacks Structural Materials Surfaces and Interfaces Thin Films Transient liquid phase bonding Tungsten
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