Materials selection investigation for thin film photovoltaic module encapsulation

•Materials and processes selected using selection methodology in CES software.•PIB and Silicone were the top candidates identified for edge seal material.•Polyethylene and Polyolefin suitable materials for inner layer laminate.•Instead of lamination, polymer extrusion and injection molding processes suitable for large scale manufacturing.•Significant cost reduction in PV encapsulation process. Encapsulation of thin film Photovoltaic (PV) modules is critical from a long term reliability and durability perspective. Currently, the methods and materials used for encapsulation of thin film PV modules are similar to those applied to crystalline silicon technology. By performing a broad-based material selection methodology to investigate materials and processes suitable for encapsulation of thin film PV modules, there exists opportunities to decrease the cost of the module fabrication and improve reliability simultaneously. In this work, functionality of components and constraints for edge seal and interlayer laminate were evaluated. The property charts were graphically mapped and the materials were screened in CES selector software with the plastic data series package. The fabrication processes for the selected material were also assessed using the software.