Diagnosis of Factors Impacting Yield in Multilayer Devices for Superconducting Electronics
The ability to localize defects in order to understand failure mechanisms in complex superconducting electronics circuits, while operating at low temperature, does not yet exist. This work applies thermally-induced voltage alteration (TIVA), to a biased superconducting electronics (SCE) circuit at a...
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| Veröffentlicht in: | IEEE transactions on applied superconductivity 2019-08, Vol.29 (5), p.1-4 |
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| creator | Missert, Nancy Jenkins, Mark W. Tangyunyong, Pai Mook, William Vernik, Igor V. Kirichenko, Alex F. Mukhanov, Oleg A. Wynn, Alex Day, Alexandra L. Bolkhovsky, Vladimir Johnson, Leonard M. |
| description | The ability to localize defects in order to understand failure mechanisms in complex superconducting electronics circuits, while operating at low temperature, does not yet exist. This work applies thermally-induced voltage alteration (TIVA), to a biased superconducting electronics (SCE) circuit at ambient temperature. TIVA is a commonly used, laser-based failure analysis technique developed for silicon-based microelectronics. The non-operational circuit consisted of an arithmetic logic unit (ALU) in a high-frequency test bed designed at HYPRES and fabricated by MIT Lincoln Laboratory using their SFQ5ee process. Localized TIVA signals were correlated with reflected light images at the surface, and these sites were further investigated by scanning electron microscopy imaging of focused ion-beam cross-sections. The areas investigated, where prominent TIVA signals were observed, showed seams in the Nb wiring layers at contacts to Josephson junctions or inductors and/or disrupted junction morphologies. These results suggest that the TIVA technique can be used at ambient temperature to diagnose fabrication defects that may cause low temperature circuit failure. |
| doi_str_mv | 10.1109/TASC.2019.2908052 |
| format | Article |
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(SNL-NM), Albuquerque, NM (United States)</creatorcontrib><description>The ability to localize defects in order to understand failure mechanisms in complex superconducting electronics circuits, while operating at low temperature, does not yet exist. This work applies thermally-induced voltage alteration (TIVA), to a biased superconducting electronics (SCE) circuit at ambient temperature. TIVA is a commonly used, laser-based failure analysis technique developed for silicon-based microelectronics. The non-operational circuit consisted of an arithmetic logic unit (ALU) in a high-frequency test bed designed at HYPRES and fabricated by MIT Lincoln Laboratory using their SFQ5ee process. Localized TIVA signals were correlated with reflected light images at the surface, and these sites were further investigated by scanning electron microscopy imaging of focused ion-beam cross-sections. The areas investigated, where prominent TIVA signals were observed, showed seams in the Nb wiring layers at contacts to Josephson junctions or inductors and/or disrupted junction morphologies. These results suggest that the TIVA technique can be used at ambient temperature to diagnose fabrication defects that may cause low temperature circuit failure.</description><identifier>ISSN: 1051-8223</identifier><identifier>EISSN: 1558-2515</identifier><identifier>DOI: 10.1109/TASC.2019.2908052</identifier><identifier>CODEN: ITASE9</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Ambient temperature ; Circuits ; Defects ; Electronic devices ; Electronics ; ENGINEERING ; Failure analysis ; Failure mechanisms ; Induced voltage ; Inductors ; Ion beams ; Josephson junctions ; Junctions ; Laser applications ; Laser transitions ; MATERIALS SCIENCE ; Measurement by laser beam ; Morphology ; Multilayers ; niobium ; Scanning electron microscopy ; Seams ; Signal processing ; superconducting integrated circuits ; Superconductivity ; Temperature measurement ; Wiring</subject><ispartof>IEEE transactions on applied superconductivity, 2019-08, Vol.29 (5), p.1-4</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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(SNL-NM), Albuquerque, NM (United States)</creatorcontrib><title>Diagnosis of Factors Impacting Yield in Multilayer Devices for Superconducting Electronics</title><title>IEEE transactions on applied superconductivity</title><addtitle>TASC</addtitle><description>The ability to localize defects in order to understand failure mechanisms in complex superconducting electronics circuits, while operating at low temperature, does not yet exist. This work applies thermally-induced voltage alteration (TIVA), to a biased superconducting electronics (SCE) circuit at ambient temperature. TIVA is a commonly used, laser-based failure analysis technique developed for silicon-based microelectronics. The non-operational circuit consisted of an arithmetic logic unit (ALU) in a high-frequency test bed designed at HYPRES and fabricated by MIT Lincoln Laboratory using their SFQ5ee process. Localized TIVA signals were correlated with reflected light images at the surface, and these sites were further investigated by scanning electron microscopy imaging of focused ion-beam cross-sections. The areas investigated, where prominent TIVA signals were observed, showed seams in the Nb wiring layers at contacts to Josephson junctions or inductors and/or disrupted junction morphologies. 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(SNL-NM), Albuquerque, NM (United States)</aucorp><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Diagnosis of Factors Impacting Yield in Multilayer Devices for Superconducting Electronics</atitle><jtitle>IEEE transactions on applied superconductivity</jtitle><stitle>TASC</stitle><date>2019-08-01</date><risdate>2019</risdate><volume>29</volume><issue>5</issue><spage>1</spage><epage>4</epage><pages>1-4</pages><issn>1051-8223</issn><eissn>1558-2515</eissn><coden>ITASE9</coden><abstract>The ability to localize defects in order to understand failure mechanisms in complex superconducting electronics circuits, while operating at low temperature, does not yet exist. This work applies thermally-induced voltage alteration (TIVA), to a biased superconducting electronics (SCE) circuit at ambient temperature. TIVA is a commonly used, laser-based failure analysis technique developed for silicon-based microelectronics. 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| subjects | Ambient temperature Circuits Defects Electronic devices Electronics ENGINEERING Failure analysis Failure mechanisms Induced voltage Inductors Ion beams Josephson junctions Junctions Laser applications Laser transitions MATERIALS SCIENCE Measurement by laser beam Morphology Multilayers niobium Scanning electron microscopy Seams Signal processing superconducting integrated circuits Superconductivity Temperature measurement Wiring |
| title | Diagnosis of Factors Impacting Yield in Multilayer Devices for Superconducting Electronics |
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