A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper
The deformation field in machining was controlled to access a range of deformation parameters—strains of 1–15, strain rates of 10–100,000 s −1 and temperatures of up to 0.4 T m—in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional S...
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| Veröffentlicht in: | Acta materialia 2009-10, Vol.57 (18), p.5491-5500 |
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| container_title | Acta materialia |
| container_volume | 57 |
| creator | Brown, Travis L. Saldana, Christopher Murthy, Tejas G. Mann, James B. Guo, Yang Allard, Larry F. King, Alexander H. Compton, W. Dale Trumble, Kevin P. Chandrasekar, Srinivasan |
| description | The deformation field in machining was controlled to access a range of deformation parameters—strains of 1–15, strain rates of 10–100,000
s
−1 and temperatures of up to 0.4
T
m—in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000
s
−1 at −196
°C and at strain rates of ⩾10,000
s
−1 even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener–Hollomon parameter. |
| doi_str_mv | 10.1016/j.actamat.2009.07.052 |
| format | Article |
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s
−1 and temperatures of up to 0.4
T
m—in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000
s
−1 at −196
°C and at strain rates of ⩾10,000
s
−1 even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener–Hollomon parameter.</description><identifier>ISSN: 1359-6454</identifier><identifier>EISSN: 1873-2453</identifier><identifier>DOI: 10.1016/j.actamat.2009.07.052</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>Applied sciences ; Copper ; Dynamic recrystallization ; Exact sciences and technology ; High speed deformation ; MATERIALS SCIENCE ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Metals. Metallurgy ; Severe plastic deformation ; Ultrafine grained microstructure</subject><ispartof>Acta materialia, 2009-10, Vol.57 (18), p.5491-5500</ispartof><rights>2009 Acta Materialia Inc.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c397t-341e5c68e9d8befe655c4059ff9568cee41edeb9e7a3cff054e98681e4c517d03</citedby><cites>FETCH-LOGICAL-c397t-341e5c68e9d8befe655c4059ff9568cee41edeb9e7a3cff054e98681e4c517d03</cites><orcidid>0000000245528277</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S1359645409004807$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>230,314,776,780,881,3537,27901,27902,65306</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=22053338$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://www.osti.gov/biblio/1435349$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Brown, Travis L.</creatorcontrib><creatorcontrib>Saldana, Christopher</creatorcontrib><creatorcontrib>Murthy, Tejas G.</creatorcontrib><creatorcontrib>Mann, James B.</creatorcontrib><creatorcontrib>Guo, Yang</creatorcontrib><creatorcontrib>Allard, Larry F.</creatorcontrib><creatorcontrib>King, Alexander H.</creatorcontrib><creatorcontrib>Compton, W. Dale</creatorcontrib><creatorcontrib>Trumble, Kevin P.</creatorcontrib><creatorcontrib>Chandrasekar, Srinivasan</creatorcontrib><creatorcontrib>Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)</creatorcontrib><title>A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper</title><title>Acta materialia</title><description>The deformation field in machining was controlled to access a range of deformation parameters—strains of 1–15, strain rates of 10–100,000
s
−1 and temperatures of up to 0.4
T
m—in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000
s
−1 at −196
°C and at strain rates of ⩾10,000
s
−1 even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener–Hollomon parameter.</description><subject>Applied sciences</subject><subject>Copper</subject><subject>Dynamic recrystallization</subject><subject>Exact sciences and technology</subject><subject>High speed deformation</subject><subject>MATERIALS SCIENCE</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Metals. Metallurgy</subject><subject>Severe plastic deformation</subject><subject>Ultrafine grained microstructure</subject><issn>1359-6454</issn><issn>1873-2453</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><recordid>eNqFkU9L7TAQxYso-PcjCEHQla1Jk7TNSkT0vQfC2-g6xOkEc-lNapJ7wW9vyr24dTUD8zszJzlVdclowyjr7laNgWzWJjctpaqhfUNle1CdsKHndSskPyw9l6ruhBTH1WlKK0pZ2wt6Un0-kJQ34xcJluQPJM5njGWd2yJBaxFyWkYpR-P87b6SaDIS40eScT0XPm_iIiUJt1i6eTIpOyAj2hCLLxf8sgTCXODz6siaKeHFvp5Vb89Pr49_65f_f_49PrzUwFWfay4YSugGVOPwjhY7KUFQqaxVshsAscxHfFfYGw7WUilQDd3AUIBk_Uj5WXW12xuKF53AZYQPCN6XN2kmuORCFehmB80xfG4wZb12CXCajMewSXphhBp4AeUOhBhSimj1HN3axC_NqF5S0Cu9T0EvKWja65JC0V3vD5gEZrLReHDpR9y2VHLOh8Ld7zgsX7J1GBfH6AFHFxfDY3C_XPoGKuyh4w</recordid><startdate>20091001</startdate><enddate>20091001</enddate><creator>Brown, Travis L.</creator><creator>Saldana, Christopher</creator><creator>Murthy, Tejas G.</creator><creator>Mann, James B.</creator><creator>Guo, Yang</creator><creator>Allard, Larry F.</creator><creator>King, Alexander H.</creator><creator>Compton, W. Dale</creator><creator>Trumble, Kevin P.</creator><creator>Chandrasekar, Srinivasan</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>OTOTI</scope><orcidid>https://orcid.org/0000000245528277</orcidid></search><sort><creationdate>20091001</creationdate><title>A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper</title><author>Brown, Travis L. ; Saldana, Christopher ; Murthy, Tejas G. ; Mann, James B. ; Guo, Yang ; Allard, Larry F. ; King, Alexander H. ; Compton, W. Dale ; Trumble, Kevin P. ; Chandrasekar, Srinivasan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c397t-341e5c68e9d8befe655c4059ff9568cee41edeb9e7a3cff054e98681e4c517d03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Applied sciences</topic><topic>Copper</topic><topic>Dynamic recrystallization</topic><topic>Exact sciences and technology</topic><topic>High speed deformation</topic><topic>MATERIALS SCIENCE</topic><topic>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</topic><topic>Metals. Metallurgy</topic><topic>Severe plastic deformation</topic><topic>Ultrafine grained microstructure</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Brown, Travis L.</creatorcontrib><creatorcontrib>Saldana, Christopher</creatorcontrib><creatorcontrib>Murthy, Tejas G.</creatorcontrib><creatorcontrib>Mann, James B.</creatorcontrib><creatorcontrib>Guo, Yang</creatorcontrib><creatorcontrib>Allard, Larry F.</creatorcontrib><creatorcontrib>King, Alexander H.</creatorcontrib><creatorcontrib>Compton, W. Dale</creatorcontrib><creatorcontrib>Trumble, Kevin P.</creatorcontrib><creatorcontrib>Chandrasekar, Srinivasan</creatorcontrib><creatorcontrib>Oak Ridge National Lab. 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s
−1 and temperatures of up to 0.4
T
m—in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000
s
−1 at −196
°C and at strain rates of ⩾10,000
s
−1 even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener–Hollomon parameter.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.actamat.2009.07.052</doi><tpages>10</tpages><orcidid>https://orcid.org/0000000245528277</orcidid></addata></record> |
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| ispartof | Acta materialia, 2009-10, Vol.57 (18), p.5491-5500 |
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| source | Elsevier ScienceDirect Journals |
| subjects | Applied sciences Copper Dynamic recrystallization Exact sciences and technology High speed deformation MATERIALS SCIENCE Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy Severe plastic deformation Ultrafine grained microstructure |
| title | A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper |
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