Mapping of Threading Screw Dislocations in 4H n-Type SiC Wafers

X-ray topography shows that selective KOH etching after CVD growth of n-type epilayers on highly N doped 4H SiC substrates can be used to reliably map pure and mixed Threading Screw Dislocations (TSD). The influence of the mapping grid density and the wafer position in the crystal on the average TSD...

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Veröffentlicht in:Materials Science Forum 2016-05, Vol.858 (5, 2016), p.376-379
Hauptverfasser: Guo, Jian Qiu, Ellison, Alexandre, Yang, Yu, Sörman, Erik, Dudley, Michael, Sundqvist, Björn, Goue, Ouloide, Raghothamachar, Balaji, Magnusson, Björn
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container_end_page 379
container_issue 5, 2016
container_start_page 376
container_title Materials Science Forum
container_volume 858
creator Guo, Jian Qiu
Ellison, Alexandre
Yang, Yu
Sörman, Erik
Dudley, Michael
Sundqvist, Björn
Goue, Ouloide
Raghothamachar, Balaji
Magnusson, Björn
description X-ray topography shows that selective KOH etching after CVD growth of n-type epilayers on highly N doped 4H SiC substrates can be used to reliably map pure and mixed Threading Screw Dislocations (TSD). The influence of the mapping grid density and the wafer position in the crystal on the average TSD density are investigated. A reliable mapping of TSD contributed to the development of 100mm SiC wafers with average TSD density down to 200 cm-2.
doi_str_mv 10.4028/www.scientific.net/MSF.858.376
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subjects Crystals
Density
Etching
Mapping
Screw dislocations
Silicon carbide
Wafers
X-ray topography
title Mapping of Threading Screw Dislocations in 4H n-Type SiC Wafers
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