CONDUCTOR FUSING AND GAPPING FOR BOND WIRES
In this paper, fusing of a metallic conductor is studied by judiciously using the solution of the one-dimensional heat equation, resulting in an approximate method for determining the threshold fusing current. The action is defined as an integration of the square of the wire current over time. The b...
Gespeichert in:
| Veröffentlicht in: | Progress in electromagnetics research M Pier M 2013-01, Vol.31, p.199-214 |
|---|---|
| Hauptverfasser: | , , , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 214 |
|---|---|
| container_issue | |
| container_start_page | 199 |
| container_title | Progress in electromagnetics research M Pier M |
| container_volume | 31 |
| creator | Chen, Kenneth C Warne, Larry K Lin, Yau T Kinzel, Robert L Huff, Johnathon D McLean, Michael B Jenkins, Mark W Rutherford, Brian M |
| description | In this paper, fusing of a metallic conductor is studied by judiciously using the solution of the one-dimensional heat equation, resulting in an approximate method for determining the threshold fusing current. The action is defined as an integration of the square of the wire current over time. The burst action (the action required to completely vaporize the material) for an exploding wire is then used to estimate the typical wire gapping action (involving wire fusing), from which gapping time can be estimated for a gapping current greater than a factor of two over the fusing current. The test data are used to determine the gapped length as a function of gapping current and to show, for a limited range, that the gapped length is inversely proportional to gapping time. The gapping length can be used as a signature of the fault current level in microelectronic circuits. |
| doi_str_mv | 10.2528/PIERM13051311 |
| format | Article |
| fullrecord | <record><control><sourceid>gale_osti_</sourceid><recordid>TN_cdi_osti_scitechconnect_1079164</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><galeid>A348647767</galeid><sourcerecordid>A348647767</sourcerecordid><originalsourceid>FETCH-LOGICAL-c370t-ae06f6010f982207f0d1996dc6d9cc3fea0edaad8bc2fb6be193af1f3f06d50f3</originalsourceid><addsrcrecordid>eNptkM1PAjEQxRujiYgevW_0aBanW2h3j-uy4CYIhI94bErb0RpgzXYv_PeW4EESM4d5efnNm8kQck-hlwyS9HlelYs3ymBAGaUXpEMzJuJUJPzyj74mN95_AXCWctEhT8VsOlwXq9kiGq2X1XQc5dNhNM7n86MeBfslANF7tSiXt-QK1dbbu9_eJetRuSpe48lsXBX5JNZMQBsrCxw5UMAsTRIQCIZmGTeam0xrhlaBNUqZdKMT3PCNDbcppMgQuBkAsi55OOXWvnXSa9da_anr_d7qVlIQGeX9AD2eoA-1tdLtsW4bpXfOa5mzfsr7QnARqN4_VChjdy5EWnTBPxuITwO6qb1vLMrvxu1UcwiL5fHL8uzL7AeoBmlB</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>CONDUCTOR FUSING AND GAPPING FOR BOND WIRES</title><source>EZB Electronic Journals Library</source><creator>Chen, Kenneth C ; Warne, Larry K ; Lin, Yau T ; Kinzel, Robert L ; Huff, Johnathon D ; McLean, Michael B ; Jenkins, Mark W ; Rutherford, Brian M</creator><creatorcontrib>Chen, Kenneth C ; Warne, Larry K ; Lin, Yau T ; Kinzel, Robert L ; Huff, Johnathon D ; McLean, Michael B ; Jenkins, Mark W ; Rutherford, Brian M ; Sandia National Lab. (SNL-CA), Livermore, CA (United States) ; Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)</creatorcontrib><description>In this paper, fusing of a metallic conductor is studied by judiciously using the solution of the one-dimensional heat equation, resulting in an approximate method for determining the threshold fusing current. The action is defined as an integration of the square of the wire current over time. The burst action (the action required to completely vaporize the material) for an exploding wire is then used to estimate the typical wire gapping action (involving wire fusing), from which gapping time can be estimated for a gapping current greater than a factor of two over the fusing current. The test data are used to determine the gapped length as a function of gapping current and to show, for a limited range, that the gapped length is inversely proportional to gapping time. The gapping length can be used as a signature of the fault current level in microelectronic circuits.</description><identifier>ISSN: 1937-8726</identifier><identifier>EISSN: 1937-8726</identifier><identifier>DOI: 10.2528/PIERM13051311</identifier><language>eng</language><publisher>United States: Electromagnetics Academy</publisher><subject>CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY ; Electrical conductivity ; Electrical wire ; Properties</subject><ispartof>Progress in electromagnetics research M Pier M, 2013-01, Vol.31, p.199-214</ispartof><rights>COPYRIGHT 2013 Electromagnetics Academy</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c370t-ae06f6010f982207f0d1996dc6d9cc3fea0edaad8bc2fb6be193af1f3f06d50f3</citedby><cites>FETCH-LOGICAL-c370t-ae06f6010f982207f0d1996dc6d9cc3fea0edaad8bc2fb6be193af1f3f06d50f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>230,314,776,780,881,27901,27902</link.rule.ids><backlink>$$Uhttps://www.osti.gov/biblio/1079164$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Chen, Kenneth C</creatorcontrib><creatorcontrib>Warne, Larry K</creatorcontrib><creatorcontrib>Lin, Yau T</creatorcontrib><creatorcontrib>Kinzel, Robert L</creatorcontrib><creatorcontrib>Huff, Johnathon D</creatorcontrib><creatorcontrib>McLean, Michael B</creatorcontrib><creatorcontrib>Jenkins, Mark W</creatorcontrib><creatorcontrib>Rutherford, Brian M</creatorcontrib><creatorcontrib>Sandia National Lab. (SNL-CA), Livermore, CA (United States)</creatorcontrib><creatorcontrib>Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)</creatorcontrib><title>CONDUCTOR FUSING AND GAPPING FOR BOND WIRES</title><title>Progress in electromagnetics research M Pier M</title><description>In this paper, fusing of a metallic conductor is studied by judiciously using the solution of the one-dimensional heat equation, resulting in an approximate method for determining the threshold fusing current. The action is defined as an integration of the square of the wire current over time. The burst action (the action required to completely vaporize the material) for an exploding wire is then used to estimate the typical wire gapping action (involving wire fusing), from which gapping time can be estimated for a gapping current greater than a factor of two over the fusing current. The test data are used to determine the gapped length as a function of gapping current and to show, for a limited range, that the gapped length is inversely proportional to gapping time. The gapping length can be used as a signature of the fault current level in microelectronic circuits.</description><subject>CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY</subject><subject>Electrical conductivity</subject><subject>Electrical wire</subject><subject>Properties</subject><issn>1937-8726</issn><issn>1937-8726</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNptkM1PAjEQxRujiYgevW_0aBanW2h3j-uy4CYIhI94bErb0RpgzXYv_PeW4EESM4d5efnNm8kQck-hlwyS9HlelYs3ymBAGaUXpEMzJuJUJPzyj74mN95_AXCWctEhT8VsOlwXq9kiGq2X1XQc5dNhNM7n86MeBfslANF7tSiXt-QK1dbbu9_eJetRuSpe48lsXBX5JNZMQBsrCxw5UMAsTRIQCIZmGTeam0xrhlaBNUqZdKMT3PCNDbcppMgQuBkAsi55OOXWvnXSa9da_anr_d7qVlIQGeX9AD2eoA-1tdLtsW4bpXfOa5mzfsr7QnARqN4_VChjdy5EWnTBPxuITwO6qb1vLMrvxu1UcwiL5fHL8uzL7AeoBmlB</recordid><startdate>20130101</startdate><enddate>20130101</enddate><creator>Chen, Kenneth C</creator><creator>Warne, Larry K</creator><creator>Lin, Yau T</creator><creator>Kinzel, Robert L</creator><creator>Huff, Johnathon D</creator><creator>McLean, Michael B</creator><creator>Jenkins, Mark W</creator><creator>Rutherford, Brian M</creator><general>Electromagnetics Academy</general><general>EMW Publishing</general><scope>AAYXX</scope><scope>CITATION</scope><scope>OTOTI</scope></search><sort><creationdate>20130101</creationdate><title>CONDUCTOR FUSING AND GAPPING FOR BOND WIRES</title><author>Chen, Kenneth C ; Warne, Larry K ; Lin, Yau T ; Kinzel, Robert L ; Huff, Johnathon D ; McLean, Michael B ; Jenkins, Mark W ; Rutherford, Brian M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c370t-ae06f6010f982207f0d1996dc6d9cc3fea0edaad8bc2fb6be193af1f3f06d50f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY</topic><topic>Electrical conductivity</topic><topic>Electrical wire</topic><topic>Properties</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, Kenneth C</creatorcontrib><creatorcontrib>Warne, Larry K</creatorcontrib><creatorcontrib>Lin, Yau T</creatorcontrib><creatorcontrib>Kinzel, Robert L</creatorcontrib><creatorcontrib>Huff, Johnathon D</creatorcontrib><creatorcontrib>McLean, Michael B</creatorcontrib><creatorcontrib>Jenkins, Mark W</creatorcontrib><creatorcontrib>Rutherford, Brian M</creatorcontrib><creatorcontrib>Sandia National Lab. (SNL-CA), Livermore, CA (United States)</creatorcontrib><creatorcontrib>Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)</creatorcontrib><collection>CrossRef</collection><collection>OSTI.GOV</collection><jtitle>Progress in electromagnetics research M Pier M</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chen, Kenneth C</au><au>Warne, Larry K</au><au>Lin, Yau T</au><au>Kinzel, Robert L</au><au>Huff, Johnathon D</au><au>McLean, Michael B</au><au>Jenkins, Mark W</au><au>Rutherford, Brian M</au><aucorp>Sandia National Lab. (SNL-CA), Livermore, CA (United States)</aucorp><aucorp>Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)</aucorp><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>CONDUCTOR FUSING AND GAPPING FOR BOND WIRES</atitle><jtitle>Progress in electromagnetics research M Pier M</jtitle><date>2013-01-01</date><risdate>2013</risdate><volume>31</volume><spage>199</spage><epage>214</epage><pages>199-214</pages><issn>1937-8726</issn><eissn>1937-8726</eissn><abstract>In this paper, fusing of a metallic conductor is studied by judiciously using the solution of the one-dimensional heat equation, resulting in an approximate method for determining the threshold fusing current. The action is defined as an integration of the square of the wire current over time. The burst action (the action required to completely vaporize the material) for an exploding wire is then used to estimate the typical wire gapping action (involving wire fusing), from which gapping time can be estimated for a gapping current greater than a factor of two over the fusing current. The test data are used to determine the gapped length as a function of gapping current and to show, for a limited range, that the gapped length is inversely proportional to gapping time. The gapping length can be used as a signature of the fault current level in microelectronic circuits.</abstract><cop>United States</cop><pub>Electromagnetics Academy</pub><doi>10.2528/PIERM13051311</doi><tpages>16</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 1937-8726 |
| ispartof | Progress in electromagnetics research M Pier M, 2013-01, Vol.31, p.199-214 |
| issn | 1937-8726 1937-8726 |
| language | eng |
| recordid | cdi_osti_scitechconnect_1079164 |
| source | EZB Electronic Journals Library |
| subjects | CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY Electrical conductivity Electrical wire Properties |
| title | CONDUCTOR FUSING AND GAPPING FOR BOND WIRES |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T04%3A17%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-gale_osti_&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=CONDUCTOR%20FUSING%20AND%20GAPPING%20FOR%20BOND%20WIRES&rft.jtitle=Progress%20in%20electromagnetics%20research%20M%20Pier%20M&rft.au=Chen,%20Kenneth%20C&rft.aucorp=Sandia%20National%20Lab.%20(SNL-CA),%20Livermore,%20CA%20(United%20States)&rft.date=2013-01-01&rft.volume=31&rft.spage=199&rft.epage=214&rft.pages=199-214&rft.issn=1937-8726&rft.eissn=1937-8726&rft_id=info:doi/10.2528/PIERM13051311&rft_dat=%3Cgale_osti_%3EA348647767%3C/gale_osti_%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_galeid=A348647767&rfr_iscdi=true |