Thermal stability of Ni–Mn electrodeposits

The effect of Mn additions on the structural stability of electrodeposited Ni is investigated by comparing the microstructure evolution of Ni and Ni–Mn specimens with similar crystallographic initial textures. As deposited, Ni–Mn electrodeposits have a smaller crystallite size and substantially high...

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Veröffentlicht in:	Acta materialia 2006-04, Vol.54 (7), p.1935-1947
Hauptverfasser:	Talin, A.A., Marquis, E.A., Goods, S.H., Kelly, J.J., Miller, M.K.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Deposition Electrodeposition Exact sciences and technology Grain boundaries GRAIN GROWTH GRAIN ORIENTATION GRAIN SIZE MATERIALS SCIENCE Metallic coatings Metals. Metallurgy MICROSTRUCTURE Nickel Ni–Mn PRECIPITATION Production techniques RECRYSTALLIZATION SEGREGATION STABILITY Strength Surface layer Surface treatment TEXTURE Thermal stability YIELD STRENGTH
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