알카리 표면개질 처리가 무전해 구리 도금피막과 폴리이미드 필름의 접합력에 미치는 효과

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by t...

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Veröffentlicht in:	Biuletyn Uniejowski 2012, 45(1), , pp.8-14
Hauptverfasser:	손이슬(Lee-Seul Son), 이호년(Ho-Nyun Lee), 이홍기(Hong Kee Lee)
Format:	Artikel
Sprache:	kor
Schlagworte:	기계공학
Online-Zugang:	Volltext
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