Enhancement of the Surface Smoothness of Cu Ribbon for Solar Cell Modules

We studied the relationship between the surface smoothness of the internal Cu ribbon and the morphology of theSn-Pb plating layer for solar cell modules. A bumpy surface was observed on the surface of the solar ribbon, whichcaused irregular reflection of light. Large, Pb-rich, primary α-phases were...

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Veröffentlicht in:Transactions on electrical and electronic materials 2015, 16(1), , pp.20-24
Hauptverfasser: Cho, Tae-Sik, Cho, Chul-Sik
Format: Artikel
Sprache:eng
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Zusammenfassung:We studied the relationship between the surface smoothness of the internal Cu ribbon and the morphology of theSn-Pb plating layer for solar cell modules. A bumpy surface was observed on the surface of the solar ribbon, whichcaused irregular reflection of light. Large, Pb-rich, primary α-phases were found below the convex surface of the solarribbon, passing from the surface of the internal Cu ribbon to the surface of the plating layer. The primary α-phasesheterogeneously nucleated on the convex surface of the Cu ribbon, and then largely grew to the convex surface of theplating layer. The restriction of the primary α-phase's formation was enabled by enhancing the smoothness of the Curibbon's surface; it was also possible to increase the adhesive strength and decrease contact resistance. We confirmedthat the solar ribbon's surface smoothness depends on the internal Cu ribbon's surface smoothness. KCI Citation Count: 2
ISSN:1229-7607
2092-7592
DOI:10.4313/TEEM.2015.16.1.20