One-step copper electroplating of carbon nanotube buckypaper using optimized electrolyte with additive chemicals

Nowadays, variable materials have been investigated to find alternative lightweight conductors instead of copper because copper has a relatively high density. Carbon nanotube (CNT) is one of the most suitable materials as an alternative conductor to Cu, thanks to its high conductivity. In addition, CNT has many other great properties, such as low density, high strength, and high ampacity. However, individual CNT loses some of its performance after the assembly process. Therefore, CNT materials have been electroplated with copper to achieve lighter conductors. In this study, CNT buckypaper (CNTBP) is fabricated using a multi-walled carbon nanotube and copper electroplated using optimizing electrolyte with the help of additive chemicals such as accelerator and suppressor. Furthermore, the effect of hydrochloric acid in the electrolyte on the electroplating of CNTBP is observed. The results show that HCl in electrolyte enhances the effectiveness of additive chemicals and provide a well-plated CNTBP@Cu composite. The composite in this study is expected to be used in various areas. Graphical abstract