Heavy Ion Induced Degradation in SiC Schottky Diodes: Bias and Energy Deposition Dependence
Experimental results on ion-induced leakage current increase in 4H-SiC Schottky power diodes are presented. Monte Carlo and TCAD simulations show that degradation is due to the synergy between applied bias and ion energy deposition. This degradation is possibly related to thermal spot annealing at t...
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Veröffentlicht in: | IEEE transactions on nuclear science 2016-10, Vol.64 (1) |
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creator | Javanainen, Arto Galloway, Kenneth F. Nicklaw, Christopher Bosser, Alexandre L. Ferlet-Cavrois, Veronique Lauenstein, Jean-Marie Pintacuda, Francesco Reed, Robert A. Schrimpf, Ronald D. Weller, Robert A. Virtanen, Ari Juha |
description | Experimental results on ion-induced leakage current increase in 4H-SiC Schottky power diodes are presented. Monte Carlo and TCAD simulations show that degradation is due to the synergy between applied bias and ion energy deposition. This degradation is possibly related to thermal spot annealing at the metal semiconductor interface. This thermal annealing leads to an inhomogeneity of the Schottky barrier that could be responsible for the increase leakage current as a function of fluence. |
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Monte Carlo and TCAD simulations show that degradation is due to the synergy between applied bias and ion energy deposition. This degradation is possibly related to thermal spot annealing at the metal semiconductor interface. This thermal annealing leads to an inhomogeneity of the Schottky barrier that could be responsible for the increase leakage current as a function of fluence.</description><identifier>ISSN: 0018-9499</identifier><identifier>EISSN: 1558-1578</identifier><language>eng</language><publisher>Goddard Space Flight Center</publisher><subject>Electronics And Electrical Engineering</subject><ispartof>IEEE transactions on nuclear science, 2016-10, Vol.64 (1)</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781</link.rule.ids></links><search><creatorcontrib>Javanainen, Arto</creatorcontrib><creatorcontrib>Galloway, Kenneth F.</creatorcontrib><creatorcontrib>Nicklaw, Christopher</creatorcontrib><creatorcontrib>Bosser, Alexandre L.</creatorcontrib><creatorcontrib>Ferlet-Cavrois, Veronique</creatorcontrib><creatorcontrib>Lauenstein, Jean-Marie</creatorcontrib><creatorcontrib>Pintacuda, Francesco</creatorcontrib><creatorcontrib>Reed, Robert A.</creatorcontrib><creatorcontrib>Schrimpf, Ronald D.</creatorcontrib><creatorcontrib>Weller, Robert A.</creatorcontrib><creatorcontrib>Virtanen, Ari Juha</creatorcontrib><title>Heavy Ion Induced Degradation in SiC Schottky Diodes: Bias and Energy Deposition Dependence</title><title>IEEE transactions on nuclear science</title><description>Experimental results on ion-induced leakage current increase in 4H-SiC Schottky power diodes are presented. Monte Carlo and TCAD simulations show that degradation is due to the synergy between applied bias and ion energy deposition. This degradation is possibly related to thermal spot annealing at the metal semiconductor interface. 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Monte Carlo and TCAD simulations show that degradation is due to the synergy between applied bias and ion energy deposition. This degradation is possibly related to thermal spot annealing at the metal semiconductor interface. This thermal annealing leads to an inhomogeneity of the Schottky barrier that could be responsible for the increase leakage current as a function of fluence.</abstract><cop>Goddard Space Flight Center</cop></addata></record> |
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title | Heavy Ion Induced Degradation in SiC Schottky Diodes: Bias and Energy Deposition Dependence |
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