Printed Circuit Board Assembly for Use in Space Missions

An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via....

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Petrick, David J., Vo, Luan, Albaijes, Dennis
Format: Report
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Petrick, David J.
Vo, Luan
Albaijes, Dennis
description An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.
format Report
fullrecord <record><control><sourceid>nasa_CYI</sourceid><recordid>TN_cdi_nasa_ntrs_20170001259</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20170001259</sourcerecordid><originalsourceid>FETCH-nasa_ntrs_201700012593</originalsourceid><addsrcrecordid>eNrjZLAIKMrMK0lNUXDOLEouzSxRcMpPLEpRcCwuTs1NyqlUSMsvUggtTlXIzFMILkhMTlXwzSwuzszPK-ZhYE1LzClO5YXS3Awybq4hzh66eYnFifF5JUXF8UYGhuYGBgaGRqaWxgSkAcmzKWA</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>report</recordtype></control><display><type>report</type><title>Printed Circuit Board Assembly for Use in Space Missions</title><source>NASA Technical Reports Server</source><creator>Petrick, David J. ; Vo, Luan ; Albaijes, Dennis</creator><creatorcontrib>Petrick, David J. ; Vo, Luan ; Albaijes, Dennis</creatorcontrib><description>An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.</description><language>eng</language><publisher>Headquarters</publisher><subject>Electronics And Electrical Engineering</subject><creationdate>2017</creationdate><rights>Copyright Determination: GOV_PUBLIC_USE_PERMITTED</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>776,796,4476</link.rule.ids><linktorsrc>$$Uhttps://ntrs.nasa.gov/citations/20170001259$$EView_record_in_NASA$$FView_record_in_$$GNASA$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Petrick, David J.</creatorcontrib><creatorcontrib>Vo, Luan</creatorcontrib><creatorcontrib>Albaijes, Dennis</creatorcontrib><title>Printed Circuit Board Assembly for Use in Space Missions</title><description>An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.</description><subject>Electronics And Electrical Engineering</subject><fulltext>true</fulltext><rsrctype>report</rsrctype><creationdate>2017</creationdate><recordtype>report</recordtype><sourceid>CYI</sourceid><recordid>eNrjZLAIKMrMK0lNUXDOLEouzSxRcMpPLEpRcCwuTs1NyqlUSMsvUggtTlXIzFMILkhMTlXwzSwuzszPK-ZhYE1LzClO5YXS3Awybq4hzh66eYnFifF5JUXF8UYGhuYGBgaGRqaWxgSkAcmzKWA</recordid><startdate>20170117</startdate><enddate>20170117</enddate><creator>Petrick, David J.</creator><creator>Vo, Luan</creator><creator>Albaijes, Dennis</creator><scope>CYE</scope><scope>CYI</scope></search><sort><creationdate>20170117</creationdate><title>Printed Circuit Board Assembly for Use in Space Missions</title><author>Petrick, David J. ; Vo, Luan ; Albaijes, Dennis</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-nasa_ntrs_201700012593</frbrgroupid><rsrctype>reports</rsrctype><prefilter>reports</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Electronics And Electrical Engineering</topic><toplevel>online_resources</toplevel><creatorcontrib>Petrick, David J.</creatorcontrib><creatorcontrib>Vo, Luan</creatorcontrib><creatorcontrib>Albaijes, Dennis</creatorcontrib><collection>NASA Scientific and Technical Information</collection><collection>NASA Technical Reports Server</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Petrick, David J.</au><au>Vo, Luan</au><au>Albaijes, Dennis</au><format>book</format><genre>unknown</genre><ristype>RPRT</ristype><btitle>Printed Circuit Board Assembly for Use in Space Missions</btitle><date>2017-01-17</date><risdate>2017</risdate><abstract>An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.</abstract><cop>Headquarters</cop><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_nasa_ntrs_20170001259
source NASA Technical Reports Server
subjects Electronics And Electrical Engineering
title Printed Circuit Board Assembly for Use in Space Missions
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T16%3A44%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-nasa_CYI&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=unknown&rft.btitle=Printed%20Circuit%20Board%20Assembly%20for%20Use%20in%20Space%20Missions&rft.au=Petrick,%20David%20J.&rft.date=2017-01-17&rft_id=info:doi/&rft_dat=%3Cnasa_CYI%3E20170001259%3C/nasa_CYI%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true