Thin Layer Composite Unimorph Ferroelectric Driver and Sensor

A method for forming ferroelectric wafers is provided. A prestress layer is placed on the desired mold. A ferroelectric wafer is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may include reinfor...

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Hauptverfasser:	Helbaum, Richard F., Bryant, Robert G., Fox, Robert L., Jalink, Antony, Jr, Rohrbach, Wayne W., Simpson, Joycelyn O.
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Sprache:	eng
Schlagworte:	Electronics And Electrical Engineering
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creator	Helbaum, Richard F. Bryant, Robert G. Fox, Robert L. Jalink, Antony, Jr Rohrbach, Wayne W. Simpson, Joycelyn O.
description	A method for forming ferroelectric wafers is provided. A prestress layer is placed on the desired mold. A ferroelectric wafer is placed on top of the prestress layer. The layers are heated and then cooled, causing the ferroelectric wafer to become prestressed. The prestress layer may include reinforcing material and the ferroelectric wafer may include electrodes or electrode layers may be placed on either side of the ferroelectric layer. Wafers produced using this method have greatly improved output motion.
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subjects	Electronics And Electrical Engineering
title	Thin Layer Composite Unimorph Ferroelectric Driver and Sensor
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