Development of a highly reliable composite board for printed circuitry for use in space environment

Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating charact...

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Bibliographische Detailangaben

Hauptverfasser:	Bradbury, E. J., Markle, R. A., Dunnavant, W. R., Stickney, P. B.
Format:	Report
Sprache:	eng
Schlagworte:	Electronic Equipment
Online-Zugang:	Volltext bestellen
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