Benchmark of Full Maxwell 3D Electromagnetic Field Solvers on an SOIC8 Packaged and Interconnected Circuit

Benchmark of Full Maxwell 3D Electromagnetic Field Solvers on an SOIC8 Packaged and Interconnected Circuit

The MAGMAS3D full Maxwell electromagnetic field solver developed at Katholieke Universiteit. Leuven is benchmarked with several commercially available solvers in the analysis of a complete industry-standard SOIC8 (single-outline integrated circuit with eight leads) circuit, packaging, and interconne...

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Veröffentlicht in:International Journal of RF and Microwave Computer-Aided Engineering 2006-03, Vol.16 (2), p.143-154
Hauptverfasser: Vrancken, Mark, Aerts, Wim, Vandenbosch, Guy
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container_title International Journal of RF and Microwave Computer-Aided Engineering
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creator Vrancken, Mark
Aerts, Wim
Vandenbosch, Guy
description The MAGMAS3D full Maxwell electromagnetic field solver developed at Katholieke Universiteit. Leuven is benchmarked with several commercially available solvers in the analysis of a complete industry-standard SOIC8 (single-outline integrated circuit with eight leads) circuit, packaging, and interconnection topology. The benchmark deals with predicted results as well as computer speed and memory. The benchmark description and results should give practicing engineers valuable insights into (at least part of) the products on the presentday full-wave 3D EM simulation market. © 2005 Wiley Periodicals, Inc.
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source Lirias (KU Leuven Association); Wiley Online Library Journals Frontfile Complete
title Benchmark of Full Maxwell 3D Electromagnetic Field Solvers on an SOIC8 Packaged and Interconnected Circuit
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