Statistical analysis of the influence of thinning processes on the strength of silicon

Silicon wafer thinning is one of the key enabling techniques in 3D-IC structures. However, the mechanical integrity of Si can be degraded by different thinning steps. In this paper, the strength of Si strips thinned by rough grinding (RG), fine grinding (FG), plasma etching (PE), and chemical-mechan...

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Bibliographische Detailangaben

Hauptverfasser:	Yang, Y, Teixeira, R.C, Roussel, P, Swinnen, B, Verlinden, Bert, De Wolf, Ingrid
Format:	Tagungsbericht
Sprache:	eng
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