Creating Mechanical Stress in the Resistive Layer as a Method of Studying its Temperature Characteristics
The separation of thick-film resistor temperature characteristics into two components is presented. One of the components is a function of the resistive material, the other a function of the linear expansion coefficient mismatch between the substrate and the resistive layer. The analysis has been ca...
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| Veröffentlicht in: | Microelectronics international 1985-02, Vol.2 (2), p.56-59 |
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| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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