Minimizing flux spatter during leadfree reflow assembly

Purpose The leaching of lead from electronic components in landfills to ground water is harmful to health and to the environment. Increasing concern over the use of lead in electronics manufacturing has led to legislation to restrict its use as a joining material. Consequently, significant recent re...

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Veröffentlicht in:	Soldering & surface mount technology 2006-07, Vol.18 (3), p.19-23
Hauptverfasser:	Manjunath, Deepak, Iyer, Satyanarayan, Eckel, Shawn, Damodaran, Purushothaman, Srihari, Krishnaswami
Format:	Artikel
Sprache:	eng
Schlagworte:	Electronics industry Solders Waste management
Online-Zugang:	Volltext
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