Feature profile simulation of silicon nitride atomic layer deposition
We perform feature-scale numerical simulations with the FPS3D software package to model the atomic layer deposition of silicon nitride using cycles of hexachlorodisilane and hydrazine. Whenever available, the results of simulations are compared with the published experimental data. These simulations...
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Veröffentlicht in: | Japanese Journal of Applied Physics 2017-06, Vol.56 (6S2), p.6 |
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creator | Moroz, Paul Moroz, Daniel J. |
description | We perform feature-scale numerical simulations with the FPS3D software package to model the atomic layer deposition of silicon nitride using cycles of hexachlorodisilane and hydrazine. Whenever available, the results of simulations are compared with the published experimental data. These simulations emphasize the power of a feature-scale approach, which is effective even for atomic layer deposition, a delicate method of materials processing. We demonstrate reasonably good agreement with the results of experiments. Based on simulations, we suggest some explanations of important phenomena such as the increase in surface roughness as the number of processing cycles increases, the rounded corners of deposited film, the small amount of impurities in the film comprised of elements of the processing gases, and the observation that typically less than a full monolayer of film is deposited per cycle. |
doi_str_mv | 10.7567/JJAP.56.06HE07 |
format | Article |
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Whenever available, the results of simulations are compared with the published experimental data. These simulations emphasize the power of a feature-scale approach, which is effective even for atomic layer deposition, a delicate method of materials processing. We demonstrate reasonably good agreement with the results of experiments. Based on simulations, we suggest some explanations of important phenomena such as the increase in surface roughness as the number of processing cycles increases, the rounded corners of deposited film, the small amount of impurities in the film comprised of elements of the processing gases, and the observation that typically less than a full monolayer of film is deposited per cycle.</description><identifier>ISSN: 0021-4922</identifier><identifier>EISSN: 1347-4065</identifier><identifier>DOI: 10.7567/JJAP.56.06HE07</identifier><identifier>CODEN: JJAPB6</identifier><language>eng</language><publisher>Tokyo: The Japan Society of Applied Physics</publisher><subject>Atomic layer epitaxy ; Computer simulation ; Hydrazines ; Materials processing ; Mathematical models ; Silicon nitride ; Simulation ; Surface roughness</subject><ispartof>Japanese Journal of Applied Physics, 2017-06, Vol.56 (6S2), p.6</ispartof><rights>2017 The Japan Society of Applied Physics</rights><rights>Copyright Japanese Journal of Applied Physics Jun 2017</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c403t-4d12228040cced17e2be002ef3ea18f4aefbb8618521348c8086d7a3fb1d22bc3</citedby><cites>FETCH-LOGICAL-c403t-4d12228040cced17e2be002ef3ea18f4aefbb8618521348c8086d7a3fb1d22bc3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://iopscience.iop.org/article/10.7567/JJAP.56.06HE07/pdf$$EPDF$$P50$$Giop$$H</linktopdf><link.rule.ids>314,780,784,27924,27925,53846,53893</link.rule.ids></links><search><creatorcontrib>Moroz, Paul</creatorcontrib><creatorcontrib>Moroz, Daniel J.</creatorcontrib><title>Feature profile simulation of silicon nitride atomic layer deposition</title><title>Japanese Journal of Applied Physics</title><addtitle>Jpn. J. Appl. Phys</addtitle><description>We perform feature-scale numerical simulations with the FPS3D software package to model the atomic layer deposition of silicon nitride using cycles of hexachlorodisilane and hydrazine. Whenever available, the results of simulations are compared with the published experimental data. These simulations emphasize the power of a feature-scale approach, which is effective even for atomic layer deposition, a delicate method of materials processing. We demonstrate reasonably good agreement with the results of experiments. Based on simulations, we suggest some explanations of important phenomena such as the increase in surface roughness as the number of processing cycles increases, the rounded corners of deposited film, the small amount of impurities in the film comprised of elements of the processing gases, and the observation that typically less than a full monolayer of film is deposited per cycle.</description><subject>Atomic layer epitaxy</subject><subject>Computer simulation</subject><subject>Hydrazines</subject><subject>Materials processing</subject><subject>Mathematical models</subject><subject>Silicon nitride</subject><subject>Simulation</subject><subject>Surface roughness</subject><issn>0021-4922</issn><issn>1347-4065</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNp1kMFLwzAUxoMoOKdXzwVvQmuSpmk8jrE5x0BBPYc0fYGUrqlJe9h_b0oHnnZ678Hv-97Hh9AjwVlZ8PJlv199ZgXPMN9tcHmFFiRnZcowL67RAmNKUvZK6S26C6GJJy8YWaDNFtQwekh674xtIQn2OLZqsK5LnIlXa3VcOzt4W0OiBne0OmnVCXxSQ--CndB7dGNUG-DhPJfoZ7v5Xu_Sw8fb-3p1SDXD-ZCymlBKBWZYa6hJCbSCmARMDooIwxSYqhKciILG7EILLHhdqtxUpKa00vkSPc2-Me3vCGGQjRt9F19KilmRM84xi1Q2U9q7EDwY2Xt7VP4kCZZTVXKqShZczlVFwfMssK7_d2wa1U8Q_6JnUPa1uQBfcP4D_E53-g</recordid><startdate>20170601</startdate><enddate>20170601</enddate><creator>Moroz, Paul</creator><creator>Moroz, Daniel J.</creator><general>The Japan Society of Applied Physics</general><general>Japanese Journal of Applied Physics</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7U5</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20170601</creationdate><title>Feature profile simulation of silicon nitride atomic layer deposition</title><author>Moroz, Paul ; Moroz, Daniel J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c403t-4d12228040cced17e2be002ef3ea18f4aefbb8618521348c8086d7a3fb1d22bc3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Atomic layer epitaxy</topic><topic>Computer simulation</topic><topic>Hydrazines</topic><topic>Materials processing</topic><topic>Mathematical models</topic><topic>Silicon nitride</topic><topic>Simulation</topic><topic>Surface roughness</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Moroz, Paul</creatorcontrib><creatorcontrib>Moroz, Daniel J.</creatorcontrib><collection>CrossRef</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Japanese Journal of Applied Physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Moroz, Paul</au><au>Moroz, Daniel J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Feature profile simulation of silicon nitride atomic layer deposition</atitle><jtitle>Japanese Journal of Applied Physics</jtitle><addtitle>Jpn. J. Appl. Phys</addtitle><date>2017-06-01</date><risdate>2017</risdate><volume>56</volume><issue>6S2</issue><spage>6</spage><pages>6-</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><coden>JJAPB6</coden><abstract>We perform feature-scale numerical simulations with the FPS3D software package to model the atomic layer deposition of silicon nitride using cycles of hexachlorodisilane and hydrazine. Whenever available, the results of simulations are compared with the published experimental data. These simulations emphasize the power of a feature-scale approach, which is effective even for atomic layer deposition, a delicate method of materials processing. We demonstrate reasonably good agreement with the results of experiments. Based on simulations, we suggest some explanations of important phenomena such as the increase in surface roughness as the number of processing cycles increases, the rounded corners of deposited film, the small amount of impurities in the film comprised of elements of the processing gases, and the observation that typically less than a full monolayer of film is deposited per cycle.</abstract><cop>Tokyo</cop><pub>The Japan Society of Applied Physics</pub><doi>10.7567/JJAP.56.06HE07</doi><tpages>8</tpages></addata></record> |
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subjects | Atomic layer epitaxy Computer simulation Hydrazines Materials processing Mathematical models Silicon nitride Simulation Surface roughness |
title | Feature profile simulation of silicon nitride atomic layer deposition |
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