Investigating electron depletion effect in amorphous indium-gallium-zinc-oxide thin-film transistor with a floating capping metal by technology computer-aided design simulation and leakage reduction

The electron distribution in an amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistor (TFT) with a floating metal-semiconductor (MS) back interface is analyzed using a technology computer-aided design (TCAD) model. The channel geometry (i.e., length and thickness) effect is carefully inv...

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Veröffentlicht in:Japanese Journal of Applied Physics 2014-06, Vol.53 (6), p.64302-1-064302-5
Hauptverfasser: Lu, Ting-Chou, Chen, Wei-Tsung, Zan, Hsiao-Wen, Ker, Ming-Dou
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container_end_page 1-064302-5
container_issue 6
container_start_page 64302
container_title Japanese Journal of Applied Physics
container_volume 53
creator Lu, Ting-Chou
Chen, Wei-Tsung
Zan, Hsiao-Wen
Ker, Ming-Dou
description The electron distribution in an amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistor (TFT) with a floating metal-semiconductor (MS) back interface is analyzed using a technology computer-aided design (TCAD) model. The channel geometry (i.e., length and thickness) effect is carefully investigated. At a high work function (i.e., 5 eV) of the capping metal, electrons inside a-IGZO are mostly removed by the capping metal (electron depletion effect). The depletion of the IGZO film leads to an increase in threshold voltage in a-IGZO TFT. TCAD simulation reveals that increasing channel length and decreasing IGZO thickness significantly enhance such an electron depletion effect. Finally, the electron depletion effect is applied to a-IGZO TFT with a high-conductivity IGZO film to greatly suppress the leakage current by over 5 orders.
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J. Appl. Phys</addtitle><date>2014-06-01</date><risdate>2014</risdate><volume>53</volume><issue>6</issue><spage>64302</spage><epage>1-064302-5</epage><pages>64302-1-064302-5</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><coden>JJAPB6</coden><abstract>The electron distribution in an amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistor (TFT) with a floating metal-semiconductor (MS) back interface is analyzed using a technology computer-aided design (TCAD) model. The channel geometry (i.e., length and thickness) effect is carefully investigated. At a high work function (i.e., 5 eV) of the capping metal, electrons inside a-IGZO are mostly removed by the capping metal (electron depletion effect). The depletion of the IGZO film leads to an increase in threshold voltage in a-IGZO TFT. TCAD simulation reveals that increasing channel length and decreasing IGZO thickness significantly enhance such an electron depletion effect. Finally, the electron depletion effect is applied to a-IGZO TFT with a high-conductivity IGZO film to greatly suppress the leakage current by over 5 orders.</abstract><pub>The Japan Society of Applied Physics</pub><doi>10.7567/JJAP.53.064302</doi><tpages>5</tpages></addata></record>
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subjects Capping
Channels
Computer aided design
Computer simulation
Depletion
Leakage current
Semiconductor devices
Thin film transistors
Transistors
title Investigating electron depletion effect in amorphous indium-gallium-zinc-oxide thin-film transistor with a floating capping metal by technology computer-aided design simulation and leakage reduction
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