SAB-Enabled Room Temperature Hybrid Bonding

3D integration is gaining more and more interest for a large panel of applications including CMOS Image Sensor, High Performance Computing, DRAM including HBM stacks and display. Image sensors based on hybrid bonding 3D stacking are the state-of-the-art in imaging applications[1]. Highest integratio...

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Veröffentlicht in:	Meeting abstracts (Electrochemical Society) 2023-12, Vol.MA2023-02 (33), p.1594-1594
Hauptverfasser:	Renaud, Pablo, Abadie, Karine, Fournel, Frank, Dubarry, Christophe, Baudin, Floriane, Tauzin, Aurelie
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext bestellen
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