Fenton-Like Reaction between Copper Ions and Hydrogen Peroxide for High Removal Rate of Tungsten in Chemical Mechanical Planarization

The Fenton reaction has been used for the tungsten oxidation under acidic conditions in tungsten chemical mechanical planarization (CMP). However, the narrow working pH window required for ideal reaction limits its application. Herein, we report a simple Fenton-like system via the reaction between c...

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Veröffentlicht in:	ECS journal of solid state science and technology 2018-01, Vol.7 (3), p.P91-P95
Hauptverfasser:	Kim, Kijung, Lee, Kangchun, So, Sounghyun, Cho, Sungwook, Lee, Myeongjae, You, Keungtae, Moon, Jinok, Song, Taeseup
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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