Water Stress Corrosion in Bonded Structures
Direct bonding is now a well-known technique to join two flat surfaces without any additional material. This technique is used in many applications and especially in SOI (Silicon-On-Insulator) elaboration or in some backside imager manufacturing processes which are now almost in mass production. Dir...
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Veröffentlicht in: | ECS journal of solid state science and technology 2015-01, Vol.4 (5), p.P124-P130 |
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Hauptverfasser: | , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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