Real-Time Prediction of Removal Rate and Friction Coefficient During Chemical Mechanical Polishing Using Motor Load Currents with a Polisher

Herein, a method for predicting real-time removal rate and friction coefficient between the pad and substrate during chemical mechanical polishing was investigated using only the load currents of two motors of a polisher. Polishers for semiconductor devices are equipped with various sensors, enablin...

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Veröffentlicht in:	ECS journal of solid state science and technology 2023-01, Vol.12 (1), p.14002
Hauptverfasser:	Uneda, Michio, Ota, Shunpei, Takiguchi, Shunsuke, Yamamoto, Yuko, Miyashita, Tadakazu, Ishikawa, Ken-ichi
Format:	Artikel
Sprache:	eng
Schlagworte:	Chemical mechanical polishing Friction coefficient Multiple regression analysis Real-time prediction Removal rate
Online-Zugang:	Volltext
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