Ultra-Low Copper Baths for Sub-35nm Copper Interconnects

The copper interconnect technology is constrained by the significant current distribution due to the terminal effect for resistive thin seeds. As a result, the current in the wafer center can become insufficient for cathodic protection of thin copper seeds leading to center seed corrosion. To improv...

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Bibliographische Detailangaben

Hauptverfasser:	Atanasova, Tanya A., Carbonell, Laureen, Caluwaerts, Rudy, Tokei, Zsolt, Strubbe, Katrien, Vereecken, Philippe M.
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext
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