Transitional Additive Adsorption with Co-Addition of Suppressor and Leveler for Copper TSV Filling

Suppression of copper electrodeposition by two additives, suppressor and leveler, were studied using a microfluidic device. In industry, two suppressing agents, one a suppressor and the other a leveler, are usually added together into the plating bath for copper bottom-up TSV (Through Silicon Via) f...

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Veröffentlicht in:	Journal of the Electrochemical Society 2020-05, Vol.167 (8), p.82513
Hauptverfasser:	Tomie, Mineyoshi, Akita, Takanori, Irita, Masaru, Hayase, Masanori
Format:	Artikel
Sprache:	eng
Schlagworte:	bottom-up copper electrodeposition leveler microfluidics suppressor TSV
Online-Zugang:	Volltext
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