Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion

Direct wafer bonding is essential in semiconductor manufacturing, with bondwave propagation dynamics influencing the overall bond quality. The main factor impacting bondwave velocity dynamics are substrate rigidity, fluid viscosity and adhesion energy between the two surfaces. The latter, which depe...

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Veröffentlicht in:	ECS transactions 2023-09, Vol.112 (3), p.23-30
Hauptverfasser:	Michaud, Laurent Gaëtan, Fournel, Frank, Morales, Christophe, Schmidbauer, Martin, Abadie, Karine, Plach, Thomas, Wimplinger, Markus
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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