(Invited) 3D Monolithic Integration

(Invited) 3D Monolithic Integration

3D Monolithic Integration with ultra-small 3D contact pitch (

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Veröffentlicht in:ECS transactions 2018-04, Vol.85 (8), p.125-130
Hauptverfasser: Brunet, Laurent, Batude, Perrine, Fenouillet-Beranger, Claire, Vinet, Maud
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container_end_page 130
container_issue 8
container_start_page 125
container_title ECS transactions
container_volume 85
creator Brunet, Laurent
Batude, Perrine
Fenouillet-Beranger, Claire
Vinet, Maud
description 3D Monolithic Integration with ultra-small 3D contact pitch (
doi_str_mv 10.1149/08508.0125ecst
format Article
fullrecord <record><control><sourceid>iop_cross</sourceid><recordid>TN_cdi_iop_journals_10_1149_08508_0125ecst</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>10.1149/08508.0125ecst</sourcerecordid><originalsourceid>FETCH-LOGICAL-c189t-9d440ce6ed4432dd0aa4eff314c67a4f4868f26717b43292fdc08a5d989cdd023</originalsourceid><addsrcrecordid>eNp1j0tLAzEURoMoWKtb1wNuVJgxr8ljKa3WgYobXYeYh6bUSUmi4L832rrs6rtwv3O5B4BzBDuEqLyBooeigwj3zuRyACZIEtEyTvjhbu4Fw8fgJOcVhKwyfAIuLofxKxRnrxoybx7jGNehvAfTDGNxb0mXEMdTcOT1OruzXU7By_3d8-yhXT4thtntsjVIyNJKSyk0jrmaBFsLtabOe4KoYVxTTwUTHjOO-GvdS-ytgUL3VgppahuTKei2d02KOSfn1SaFD52-FYLqV1H9Kap_xQpcb4EQN2oVP9NY39tX_gE6Q1C8</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>(Invited) 3D Monolithic Integration</title><source>HEAL-Link subscriptions: Institute of Physics (IOP) Journals</source><source>Institute of Physics Journals</source><creator>Brunet, Laurent ; Batude, Perrine ; Fenouillet-Beranger, Claire ; Vinet, Maud</creator><creatorcontrib>Brunet, Laurent ; Batude, Perrine ; Fenouillet-Beranger, Claire ; Vinet, Maud</creatorcontrib><description>3D Monolithic Integration with ultra-small 3D contact pitch (&lt;100nm) offers new 3D partitioning options at fine granularities. This paper reviews potential applications ranging from computing to sensor interface and gives an update on 3DSI device development.</description><identifier>ISSN: 1938-5862</identifier><identifier>ISSN: 1938-6737</identifier><identifier>EISSN: 1938-6737</identifier><identifier>EISSN: 1938-5862</identifier><identifier>DOI: 10.1149/08508.0125ecst</identifier><language>eng</language><publisher>The Electrochemical Society, Inc</publisher><ispartof>ECS transactions, 2018-04, Vol.85 (8), p.125-130</ispartof><rights>2018 ECS - The Electrochemical Society</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c189t-9d440ce6ed4432dd0aa4eff314c67a4f4868f26717b43292fdc08a5d989cdd023</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://iopscience.iop.org/article/10.1149/08508.0125ecst/pdf$$EPDF$$P50$$Giop$$H</linktopdf><link.rule.ids>314,776,780,27903,27904,53825,53872</link.rule.ids></links><search><creatorcontrib>Brunet, Laurent</creatorcontrib><creatorcontrib>Batude, Perrine</creatorcontrib><creatorcontrib>Fenouillet-Beranger, Claire</creatorcontrib><creatorcontrib>Vinet, Maud</creatorcontrib><title>(Invited) 3D Monolithic Integration</title><title>ECS transactions</title><addtitle>ECS Trans</addtitle><description>3D Monolithic Integration with ultra-small 3D contact pitch (&lt;100nm) offers new 3D partitioning options at fine granularities. This paper reviews potential applications ranging from computing to sensor interface and gives an update on 3DSI device development.</description><issn>1938-5862</issn><issn>1938-6737</issn><issn>1938-6737</issn><issn>1938-5862</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNp1j0tLAzEURoMoWKtb1wNuVJgxr8ljKa3WgYobXYeYh6bUSUmi4L832rrs6rtwv3O5B4BzBDuEqLyBooeigwj3zuRyACZIEtEyTvjhbu4Fw8fgJOcVhKwyfAIuLofxKxRnrxoybx7jGNehvAfTDGNxb0mXEMdTcOT1OruzXU7By_3d8-yhXT4thtntsjVIyNJKSyk0jrmaBFsLtabOe4KoYVxTTwUTHjOO-GvdS-ytgUL3VgppahuTKei2d02KOSfn1SaFD52-FYLqV1H9Kap_xQpcb4EQN2oVP9NY39tX_gE6Q1C8</recordid><startdate>20180410</startdate><enddate>20180410</enddate><creator>Brunet, Laurent</creator><creator>Batude, Perrine</creator><creator>Fenouillet-Beranger, Claire</creator><creator>Vinet, Maud</creator><general>The Electrochemical Society, Inc</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20180410</creationdate><title>(Invited) 3D Monolithic Integration</title><author>Brunet, Laurent ; Batude, Perrine ; Fenouillet-Beranger, Claire ; Vinet, Maud</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c189t-9d440ce6ed4432dd0aa4eff314c67a4f4868f26717b43292fdc08a5d989cdd023</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Brunet, Laurent</creatorcontrib><creatorcontrib>Batude, Perrine</creatorcontrib><creatorcontrib>Fenouillet-Beranger, Claire</creatorcontrib><creatorcontrib>Vinet, Maud</creatorcontrib><collection>CrossRef</collection><jtitle>ECS transactions</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Brunet, Laurent</au><au>Batude, Perrine</au><au>Fenouillet-Beranger, Claire</au><au>Vinet, Maud</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>(Invited) 3D Monolithic Integration</atitle><jtitle>ECS transactions</jtitle><addtitle>ECS Trans</addtitle><date>2018-04-10</date><risdate>2018</risdate><volume>85</volume><issue>8</issue><spage>125</spage><epage>130</epage><pages>125-130</pages><issn>1938-5862</issn><issn>1938-6737</issn><eissn>1938-6737</eissn><eissn>1938-5862</eissn><abstract>3D Monolithic Integration with ultra-small 3D contact pitch (&lt;100nm) offers new 3D partitioning options at fine granularities. This paper reviews potential applications ranging from computing to sensor interface and gives an update on 3DSI device development.</abstract><pub>The Electrochemical Society, Inc</pub><doi>10.1149/08508.0125ecst</doi><tpages>6</tpages></addata></record>
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identifier ISSN: 1938-5862
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1938-6737
1938-6737
1938-5862
language eng
recordid cdi_iop_journals_10_1149_08508_0125ecst
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title (Invited) 3D Monolithic Integration
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T20%3A29%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-iop_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=(Invited)%203D%20Monolithic%20Integration&rft.jtitle=ECS%20transactions&rft.au=Brunet,%20Laurent&rft.date=2018-04-10&rft.volume=85&rft.issue=8&rft.spage=125&rft.epage=130&rft.pages=125-130&rft.issn=1938-5862&rft.eissn=1938-6737&rft_id=info:doi/10.1149/08508.0125ecst&rft_dat=%3Ciop_cross%3E10.1149/08508.0125ecst%3C/iop_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true