Aluminum-Germanium Eutectic Bonding for MEMS: Behaviour and Solidification of Liquid Al-Ge on Different Substrates

In this paper we study the formation and behaviour of liquid Al-Ge alloy, its solidification, the resulting microstructures and the appearance of voids in bonded structure for MEMS packaging. The underneath layer influences the wettability of liquid Al-Ge as well as its solidification which can lead...

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Bibliographische Detailangaben

Hauptverfasser:	Lumineau, Victor, Fournel, Frank, Imbert, Bruno, Hodaj, Fiqiri
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext
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