Packaging Techniques for Compact SiC Power Modules Operable in an Extended Tj Range

Packaging technology applicable to SiC power devices operated in an extended junction temperature range (Tjmax > 200°C) must be developed in order to create much more compact and cost-effective SiC power modules. This paper describes some of the technical challenges involved in improving the reli...

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Veröffentlicht in:	ECS transactions 2013-08, Vol.58 (4), p.33-47
Hauptverfasser:	Tanimoto, Satoshi, Watanabe, Kinuyo, Tanisawa, Hidekazu, Matsui, Kohei, Sato, Shinji
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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