Conformally printed additively manufactured RF demonstrator for circuit compaction

Recently, there has been interest in applying additive manufacturing (AM) to radio frequency (RF) and microwave applications, especially in packaging of microelectronic devices. Additive packaging offers advantages of expanded functionality in restricted volume, through miniature, low-SWaP-C sensors...

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Bibliographische Detailangaben

Veröffentlicht in:	Flexible and printed electronics 2024-12, Vol.9 (4), p.45007
Hauptverfasser:	Luce, Andrew, Areias, Christopher, Trulli, Susan, Harper, Elicia, Zhang, Yiwen, Strack, Guinevere, Lovaasen, John, Akyurtlu, Alkim
Format:	Artikel
Sprache:	eng
Schlagworte:	additive manufacturing aerosol jet printing non-planar circuits printed electronics
Online-Zugang:	Volltext
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