Coupling effects of matrix and interface on synergetic deformation behaviors of Cu/Al composite plates

In this study, uniaxial tensile tests of Cu/Al laminated composites under different heat treatments were carried out to investigate the coupling effects of interface bonding strength and matrix strengths of copper and aluminum layers on the plastic deformation behaviors. Experiment results indicated that as the heat treatment temperature increased, the interfacial bonding strengths of Cu/Al composite plates increased first and then decreased, and reached the maximum value of 100 N mm−1 at 300 °C. Meanwhile, the strength difference of separated Cu and Al hardly changed below 300 °C and decreased rapidly above 300 °C. An integrated analysis revealed that both high interfacial bonding strength and low strength difference between separated Cu and Al were beneficial for enhancing the cooperative deformation performance of copper-aluminum laminated composite. But, low strength difference between separated Cu and Al played a leading role even though the interface bonding strength was unfavorable during the cooperative deformation process of copper-aluminum laminated composites.