Single-crystal silicon ablation with temporally delayed femtosecond laser double-pulse trains

A double-pulse femtosecond laser is used to process single-crystal silicon. Modulating the delay time was discovered to increase the ablation depth and improve the morphology of the ablated surface. The hole fabricated by a dual-pulse with a 200 ps interval is 24.4% deeper than that created by a sin...

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Veröffentlicht in:	Journal of physics. D, Applied physics Applied physics, 2024-11, Vol.57 (47), p.475106
Hauptverfasser:	Fan, Zhengjie, Yi, Liangtian, Lv, Jing, Wang, Wenjun, Li, Guoji, Cui, Jianlei
Format:	Artikel
Sprache:	eng
Schlagworte:	double-pulse femtosecond laser laser drilling sub-pulse temporally delayed ultrafast laser processing
Online-Zugang:	Volltext
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