Influence and mitigation of long differential via stub on signal integrity
How the long differential via stub influences the time-domain response and the eye diagram of the signal trace in a thick multilayer printed circuit board is investigated. Then, it is proved that RL termination has the same efficiency as R and RC terminations on improving signal integrity and the ey...
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| Veröffentlicht in: | Electronics letters 2015-06, Vol.51 (13), p.975-977 |
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| container_end_page | 977 |
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| container_issue | 13 |
| container_start_page | 975 |
| container_title | Electronics letters |
| container_volume | 51 |
| creator | Wang, Jun Lu, Jian-Min Chu, Xiu-Qin Liu, Yang Lai, Xin-Quan Li, Yu-Shan |
| description | How the long differential via stub influences the time-domain response and the eye diagram of the signal trace in a thick multilayer printed circuit board is investigated. Then, it is proved that RL termination has the same efficiency as R and RC terminations on improving signal integrity and the eye diagram. Finally, a method is proposed to mitigate the influence of the via stub by combining mismatched R termination and reflection gain at the receiving end. |
| doi_str_mv | 10.1049/el.2015.0823 |
| format | Article |
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Then, it is proved that RL termination has the same efficiency as R and RC terminations on improving signal integrity and the eye diagram. Finally, a method is proposed to mitigate the influence of the via stub by combining mismatched R termination and reflection gain at the receiving end.</description><identifier>ISSN: 0013-5194</identifier><identifier>ISSN: 1350-911X</identifier><identifier>EISSN: 1350-911X</identifier><identifier>DOI: 10.1049/el.2015.0823</identifier><language>eng</language><publisher>The Institution of Engineering and Technology</publisher><subject>Boards ; Circuits and systems ; eye diagram ; Eyes ; Gain ; long differential via stub ; Multilayers ; PCB ; Printed circuits ; RC circuits ; RC terminations ; Receiving ; Reflection ; reflection gain ; RL termination ; Signal integrity ; signal trace ; thick multilayer printed circuit board ; time‐domain analysis ; time‐domain response</subject><ispartof>Electronics letters, 2015-06, Vol.51 (13), p.975-977</ispartof><rights>The Institution of Engineering and Technology</rights><rights>2020 The Institution of Engineering and Technology</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c4143-d9af577498f11aa151ab46ca1009e1f7faa926d10deed19d10712570dfeca3a93</citedby><cites>FETCH-LOGICAL-c4143-d9af577498f11aa151ab46ca1009e1f7faa926d10deed19d10712570dfeca3a93</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1049%2Fel.2015.0823$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1049%2Fel.2015.0823$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,776,780,1411,11541,27901,27902,45550,45551,46027,46451</link.rule.ids><linktorsrc>$$Uhttps://onlinelibrary.wiley.com/doi/abs/10.1049%2Fel.2015.0823$$EView_record_in_Wiley-Blackwell$$FView_record_in_$$GWiley-Blackwell</linktorsrc></links><search><creatorcontrib>Wang, Jun</creatorcontrib><creatorcontrib>Lu, Jian-Min</creatorcontrib><creatorcontrib>Chu, Xiu-Qin</creatorcontrib><creatorcontrib>Liu, Yang</creatorcontrib><creatorcontrib>Lai, Xin-Quan</creatorcontrib><creatorcontrib>Li, Yu-Shan</creatorcontrib><title>Influence and mitigation of long differential via stub on signal integrity</title><title>Electronics letters</title><description>How the long differential via stub influences the time-domain response and the eye diagram of the signal trace in a thick multilayer printed circuit board is investigated. Then, it is proved that RL termination has the same efficiency as R and RC terminations on improving signal integrity and the eye diagram. Finally, a method is proposed to mitigate the influence of the via stub by combining mismatched R termination and reflection gain at the receiving end.</description><subject>Boards</subject><subject>Circuits and systems</subject><subject>eye diagram</subject><subject>Eyes</subject><subject>Gain</subject><subject>long differential via stub</subject><subject>Multilayers</subject><subject>PCB</subject><subject>Printed circuits</subject><subject>RC circuits</subject><subject>RC terminations</subject><subject>Receiving</subject><subject>Reflection</subject><subject>reflection gain</subject><subject>RL termination</subject><subject>Signal integrity</subject><subject>signal trace</subject><subject>thick multilayer printed circuit board</subject><subject>time‐domain analysis</subject><subject>time‐domain response</subject><issn>0013-5194</issn><issn>1350-911X</issn><issn>1350-911X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><recordid>eNp90M9LwzAUB_AgCo65m39ADx482Plefy5HHZtOCl4UvIWsfSmRLJ1Nq-y_N6WCCiI5vBA-7-XxZewcYY6Q8Gsy8wgwncMiio_YBOMUQo74cswmABiHKfLklM2c01vABJMMEpywh41VpidbUiBtFex0p2vZ6cYGjQpMY-ug0kpRS7bT0gTvWgau67eBB07X1j9p21Hd6u5wxk6UNI5mX3XKnterp-V9WDzebZY3RVj6X-Ow4lKleZ7whUKUElOU2yQrJQJwQpUrKXmUVQgVUYXcX3KM0hwqRaWMJY-n7HKcu2-bt55cJ3balWSMtNT0TuAC_Ekhzjy9GmnZNs61pMS-1TvZHgSCGFITZMSQmhhS8zwd-Yc2dPjXilVRRLdriLJs6LsY-zR14rXpW5-L8-IH31fqe_Ff7M9NPgFpTIgq</recordid><startdate>20150625</startdate><enddate>20150625</enddate><creator>Wang, Jun</creator><creator>Lu, Jian-Min</creator><creator>Chu, Xiu-Qin</creator><creator>Liu, Yang</creator><creator>Lai, Xin-Quan</creator><creator>Li, Yu-Shan</creator><general>The Institution of Engineering and Technology</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope></search><sort><creationdate>20150625</creationdate><title>Influence and mitigation of long differential via stub on signal integrity</title><author>Wang, Jun ; Lu, Jian-Min ; Chu, Xiu-Qin ; Liu, Yang ; Lai, Xin-Quan ; Li, Yu-Shan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c4143-d9af577498f11aa151ab46ca1009e1f7faa926d10deed19d10712570dfeca3a93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Boards</topic><topic>Circuits and systems</topic><topic>eye diagram</topic><topic>Eyes</topic><topic>Gain</topic><topic>long differential via stub</topic><topic>Multilayers</topic><topic>PCB</topic><topic>Printed circuits</topic><topic>RC circuits</topic><topic>RC terminations</topic><topic>Receiving</topic><topic>Reflection</topic><topic>reflection gain</topic><topic>RL termination</topic><topic>Signal integrity</topic><topic>signal trace</topic><topic>thick multilayer printed circuit board</topic><topic>time‐domain analysis</topic><topic>time‐domain response</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Jun</creatorcontrib><creatorcontrib>Lu, Jian-Min</creatorcontrib><creatorcontrib>Chu, Xiu-Qin</creatorcontrib><creatorcontrib>Liu, Yang</creatorcontrib><creatorcontrib>Lai, Xin-Quan</creatorcontrib><creatorcontrib>Li, Yu-Shan</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Electronics letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wang, Jun</au><au>Lu, Jian-Min</au><au>Chu, Xiu-Qin</au><au>Liu, Yang</au><au>Lai, Xin-Quan</au><au>Li, Yu-Shan</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence and mitigation of long differential via stub on signal integrity</atitle><jtitle>Electronics letters</jtitle><date>2015-06-25</date><risdate>2015</risdate><volume>51</volume><issue>13</issue><spage>975</spage><epage>977</epage><pages>975-977</pages><issn>0013-5194</issn><issn>1350-911X</issn><eissn>1350-911X</eissn><abstract>How the long differential via stub influences the time-domain response and the eye diagram of the signal trace in a thick multilayer printed circuit board is investigated. Then, it is proved that RL termination has the same efficiency as R and RC terminations on improving signal integrity and the eye diagram. Finally, a method is proposed to mitigate the influence of the via stub by combining mismatched R termination and reflection gain at the receiving end.</abstract><pub>The Institution of Engineering and Technology</pub><doi>10.1049/el.2015.0823</doi><tpages>3</tpages><oa>free_for_read</oa></addata></record> |
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| ispartof | Electronics letters, 2015-06, Vol.51 (13), p.975-977 |
| issn | 0013-5194 1350-911X 1350-911X |
| language | eng |
| recordid | cdi_iet_journals_10_1049_el_2015_0823 |
| source | Wiley-Blackwell Open Access Titles |
| subjects | Boards Circuits and systems eye diagram Eyes Gain long differential via stub Multilayers PCB Printed circuits RC circuits RC terminations Receiving Reflection reflection gain RL termination Signal integrity signal trace thick multilayer printed circuit board time‐domain analysis time‐domain response |
| title | Influence and mitigation of long differential via stub on signal integrity |
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