A new model for electrical ageing and breakdown in dielectrics

We derive a simple but generally applicable model for multi-factor ageing in which thermally-induced bond scission is a universal underlying physical process which determines ageing. The final destruction of the dielectric is assumed to occur by a Griffith-crack treeing process and this will have a...

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Bibliographische Detailangaben
Hauptverfasser: Lewis, T.J, Llewellyn, J.P, van der Sluijs, M.J, Freestone, J, Hampton, R.N
Format: Tagungsbericht
Sprache:eng
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