A micro-packaged image acquisition and processing module

The paper describes a prototype module, which is an image acquisition and processing pipeline implemented in a micro-package. The module converts incident light directly to processed digital video data. The system is packaged using a novel three-dimensional technology called MCM-V (multichip module-...

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Hauptverfasser:	Larcombe, S.P, Stern, J.M, Ivey, P.A, Seed, N.L, Shelley, A.J
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Audio and video equipment manufacturing Digital signal processing chips Instrumentation Microprocessors and microcomputers Multichip modules Packaging Parallel architecture Pattern recognition and computer vision equipment Product packaging Semiconductor integrated circuits Signal processing and conditioning equipment and techniques
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creator	Larcombe, S.P Stern, J.M Ivey, P.A Seed, N.L Shelley, A.J
description	The paper describes a prototype module, which is an image acquisition and processing pipeline implemented in a micro-package. The module converts incident light directly to processed digital video data. The system is packaged using a novel three-dimensional technology called MCM-V (multichip module-vertical), Val (1991). This technology stacks integrated circuits in the z-axis to produce dense systems. The module is fully programmable and can be used in a wide range of image processing tasks. The results presented form the first stage in the development of high performance ultra-miniature camera and image processing systems.
doi_str_mv	10.1049/cp:19950700
format	Conference Proceeding
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identifier	ISBN: 0852966423
ispartof	Fifth International Conference on Image Processing and its Applications, 1995, p.455-459
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language	eng
recordid	cdi_iet_conferences_10_1049_cp_19950700
source	IEEE Electronic Library (IEL) Conference Proceedings
subjects	Audio and video equipment manufacturing Digital signal processing chips Instrumentation Microprocessors and microcomputers Multichip modules Packaging Parallel architecture Pattern recognition and computer vision equipment Product packaging Semiconductor integrated circuits Signal processing and conditioning equipment and techniques
title	A micro-packaged image acquisition and processing module
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