Environmentally conscious IC molding compound without toxic flame-retardants

A new environmentally friendly, self-extinguishing epoxy-resin compound with no flame-retardants (such as halogen derivatives) has been developed for integrated circuit (IC) packaging. This compound mainly consists of phenol-aralkyl-type epoxy resin and hardener both of which contain a multi-aromati...

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Hauptverfasser:	Kiuchi, Y., Iji, M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Additives Combustion Epoxy resins Fires Heat transfer Integrated circuit packaging Large scale integration Powders Silicon compounds Surface resistance
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creator	Kiuchi, Y. Iji, M.
description	A new environmentally friendly, self-extinguishing epoxy-resin compound with no flame-retardants (such as halogen derivatives) has been developed for integrated circuit (IC) packaging. This compound mainly consists of phenol-aralkyl-type epoxy resin and hardener both of which contain a multi-aromatic substituent, fused silica powder, and additives. The compound has a high flame retardancy resulting from the formation of a stable foam layer, which retards heat transfer on the surface of the resin compound during combustion. Furthermore, the compound shows other excellent characteristics as a molding compound for IC packages. In fact, its packaging-reliability characteristics, those including resistance to humidity, soldering heat, and the effects of high-temperature storage, are better than those of current molding compounds used for large-scale integration (LSI) packaging. The new molding compound has thus already been applied to IC packages such as ball grid arrays (BGAs).
doi_str_mv	10.1109/ISSM.2000.993636
format	Conference Proceeding
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The new molding compound has thus already been applied to IC packages such as ball grid arrays (BGAs).</description><subject>Additives</subject><subject>Combustion</subject><subject>Epoxy resins</subject><subject>Fires</subject><subject>Heat transfer</subject><subject>Integrated circuit packaging</subject><subject>Large scale integration</subject><subject>Powders</subject><subject>Silicon compounds</subject><subject>Surface resistance</subject><issn>1523-553X</issn><isbn>9780780373921</isbn><isbn>0780373928</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2000</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj0FLwzAYhgMqOOfu4ql_oDXJ1zbNUcrUwsTDFLyNJP2ikTYZTaru3zuY8MIDz-GBl5AbRgvGqLzrttvnglNKCymhhvqMrKRo6HEgQHJ2Thas4pBXFbxfkqsYvyjlFKRYkM3af7sp-BF9UsNwyEzw0bgwx6xrszEMvfMfRznuw-z77MelzzCnLIVfZzI7qBHzCZOaeuVTvCYXVg0RV_9ckreH9Wv7lG9eHrv2fpM7JnjKUWtlWCmRNii0RqXBcMuhtAYt7yttem4VNz2zZdlgTctKaABEyZBzAbAkt6euQ8TdfnKjmg6703f4A-sxUEE</recordid><startdate>2000</startdate><enddate>2000</enddate><creator>Kiuchi, Y.</creator><creator>Iji, M.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2000</creationdate><title>Environmentally conscious IC molding compound without toxic flame-retardants</title><author>Kiuchi, Y. ; Iji, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i172t-ebbac149e08e7bbeab3c2f234fcef2d5bcd2fa2cd1f448e60457b33ee91e22733</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Additives</topic><topic>Combustion</topic><topic>Epoxy resins</topic><topic>Fires</topic><topic>Heat transfer</topic><topic>Integrated circuit packaging</topic><topic>Large scale integration</topic><topic>Powders</topic><topic>Silicon compounds</topic><topic>Surface resistance</topic><toplevel>online_resources</toplevel><creatorcontrib>Kiuchi, Y.</creatorcontrib><creatorcontrib>Iji, M.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kiuchi, Y.</au><au>Iji, M.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Environmentally conscious IC molding compound without toxic flame-retardants</atitle><btitle>Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)</btitle><stitle>ISSM</stitle><date>2000</date><risdate>2000</risdate><spage>147</spage><epage>150</epage><pages>147-150</pages><issn>1523-553X</issn><isbn>9780780373921</isbn><isbn>0780373928</isbn><abstract>A new environmentally friendly, self-extinguishing epoxy-resin compound with no flame-retardants (such as halogen derivatives) has been developed for integrated circuit (IC) packaging. This compound mainly consists of phenol-aralkyl-type epoxy resin and hardener both of which contain a multi-aromatic substituent, fused silica powder, and additives. The compound has a high flame retardancy resulting from the formation of a stable foam layer, which retards heat transfer on the surface of the resin compound during combustion. Furthermore, the compound shows other excellent characteristics as a molding compound for IC packages. In fact, its packaging-reliability characteristics, those including resistance to humidity, soldering heat, and the effects of high-temperature storage, are better than those of current molding compounds used for large-scale integration (LSI) packaging. The new molding compound has thus already been applied to IC packages such as ball grid arrays (BGAs).</abstract><pub>IEEE</pub><doi>10.1109/ISSM.2000.993636</doi><tpages>4</tpages></addata></record>
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language	eng
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source	IEEE Electronic Library (IEL) Conference Proceedings
subjects	Additives Combustion Epoxy resins Fires Heat transfer Integrated circuit packaging Large scale integration Powders Silicon compounds Surface resistance
title	Environmentally conscious IC molding compound without toxic flame-retardants
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