Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts
We developed self-extinguishing epoxy-resin compounds that contain no environmentally hazardous flame-retardants such as halogen or phosphorous derivatives, and used these compounds to develop an integrated circuit (IC) molding compound and an insulating material for printed wiring boards (PWBs). Th...
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creator | Kiuchi, Y. Iji, M. |
description | We developed self-extinguishing epoxy-resin compounds that contain no environmentally hazardous flame-retardants such as halogen or phosphorous derivatives, and used these compounds to develop an integrated circuit (IC) molding compound and an insulating material for printed wiring boards (PWBs). The new epoxy-resin compounds consist mainly of phenol-aralkyl-type epoxy resins and hardeners; stable foam layers retard heat transfer and thus have self extinguishing properties. Especially beneficial is the fact that the IC molding compound based on the new compounds, can withstand higher temperatures required for lead-free soldering. The PWB also contains a limited amount of safe metal hydroxide. |
doi_str_mv | 10.1109/ECODIM.2001.992513 |
format | Conference Proceeding |
fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_992513</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>992513</ieee_id><sourcerecordid>992513</sourcerecordid><originalsourceid>FETCH-LOGICAL-i174t-c34e7dff6149ae964e495cf25777404cfe448ebd0020415b3cff3bedc5f853e93</originalsourceid><addsrcrecordid>eNotUMFOAyEUJDEmmtof6Ikf2AoLLOVo2qpNanrRc0PhkWJYICyt7Q_43a7RucxMMu9NMgjNKJlTStTjerlbbd7mLSF0rlQrKLtBUyUXRHZK0Lbr2js0HYZPMoIpLqm4R98rOENIuYdYcXIY4tmXFH-tDuGKXfEQ7Sggp8u1KTD4iE3qczpFO-AvX4_pVHFNF2-wC7oHXKDqYnWsA9bR4noEX7DOOXijq09xDGMIYOrYMx5lXerwgG6dDgNM_3mCPp7X78vXZrt72Syfto2nktfGMA7SOtdRrjSojgNXwrhWSCk54cYB5ws4WEJawqk4MOMcO4A1wi0EA8UmaPb31wPAPhff63Ld_43FfgB5pWT-</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Kiuchi, Y. ; Iji, M.</creator><creatorcontrib>Kiuchi, Y. ; Iji, M.</creatorcontrib><description>We developed self-extinguishing epoxy-resin compounds that contain no environmentally hazardous flame-retardants such as halogen or phosphorous derivatives, and used these compounds to develop an integrated circuit (IC) molding compound and an insulating material for printed wiring boards (PWBs). The new epoxy-resin compounds consist mainly of phenol-aralkyl-type epoxy resins and hardeners; stable foam layers retard heat transfer and thus have self extinguishing properties. Especially beneficial is the fact that the IC molding compound based on the new compounds, can withstand higher temperatures required for lead-free soldering. The PWB also contains a limited amount of safe metal hydroxide.</description><identifier>ISBN: 9780769512662</identifier><identifier>ISBN: 0769512666</identifier><identifier>DOI: 10.1109/ECODIM.2001.992513</identifier><language>eng</language><publisher>IEEE</publisher><subject>Additives ; Application specific integrated circuits ; Epoxy resins ; Flame retardants ; Hazardous materials ; Insulation ; Integrated circuit technology ; National electric code ; Waste materials ; Wiring</subject><ispartof>Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 2001, p.1020-1025</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/992513$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2056,4040,4041,27916,54911</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/992513$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Kiuchi, Y.</creatorcontrib><creatorcontrib>Iji, M.</creatorcontrib><title>Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts</title><title>Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing</title><addtitle>ECODIM</addtitle><description>We developed self-extinguishing epoxy-resin compounds that contain no environmentally hazardous flame-retardants such as halogen or phosphorous derivatives, and used these compounds to develop an integrated circuit (IC) molding compound and an insulating material for printed wiring boards (PWBs). The new epoxy-resin compounds consist mainly of phenol-aralkyl-type epoxy resins and hardeners; stable foam layers retard heat transfer and thus have self extinguishing properties. Especially beneficial is the fact that the IC molding compound based on the new compounds, can withstand higher temperatures required for lead-free soldering. The PWB also contains a limited amount of safe metal hydroxide.</description><subject>Additives</subject><subject>Application specific integrated circuits</subject><subject>Epoxy resins</subject><subject>Flame retardants</subject><subject>Hazardous materials</subject><subject>Insulation</subject><subject>Integrated circuit technology</subject><subject>National electric code</subject><subject>Waste materials</subject><subject>Wiring</subject><isbn>9780769512662</isbn><isbn>0769512666</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2001</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotUMFOAyEUJDEmmtof6Ikf2AoLLOVo2qpNanrRc0PhkWJYICyt7Q_43a7RucxMMu9NMgjNKJlTStTjerlbbd7mLSF0rlQrKLtBUyUXRHZK0Lbr2js0HYZPMoIpLqm4R98rOENIuYdYcXIY4tmXFH-tDuGKXfEQ7Sggp8u1KTD4iE3qczpFO-AvX4_pVHFNF2-wC7oHXKDqYnWsA9bR4noEX7DOOXijq09xDGMIYOrYMx5lXerwgG6dDgNM_3mCPp7X78vXZrt72Syfto2nktfGMA7SOtdRrjSojgNXwrhWSCk54cYB5ws4WEJawqk4MOMcO4A1wi0EA8UmaPb31wPAPhff63Ld_43FfgB5pWT-</recordid><startdate>2001</startdate><enddate>2001</enddate><creator>Kiuchi, Y.</creator><creator>Iji, M.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2001</creationdate><title>Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts</title><author>Kiuchi, Y. ; Iji, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i174t-c34e7dff6149ae964e495cf25777404cfe448ebd0020415b3cff3bedc5f853e93</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Additives</topic><topic>Application specific integrated circuits</topic><topic>Epoxy resins</topic><topic>Flame retardants</topic><topic>Hazardous materials</topic><topic>Insulation</topic><topic>Integrated circuit technology</topic><topic>National electric code</topic><topic>Waste materials</topic><topic>Wiring</topic><toplevel>online_resources</toplevel><creatorcontrib>Kiuchi, Y.</creatorcontrib><creatorcontrib>Iji, M.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kiuchi, Y.</au><au>Iji, M.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts</atitle><btitle>Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing</btitle><stitle>ECODIM</stitle><date>2001</date><risdate>2001</risdate><spage>1020</spage><epage>1025</epage><pages>1020-1025</pages><isbn>9780769512662</isbn><isbn>0769512666</isbn><abstract>We developed self-extinguishing epoxy-resin compounds that contain no environmentally hazardous flame-retardants such as halogen or phosphorous derivatives, and used these compounds to develop an integrated circuit (IC) molding compound and an insulating material for printed wiring boards (PWBs). The new epoxy-resin compounds consist mainly of phenol-aralkyl-type epoxy resins and hardeners; stable foam layers retard heat transfer and thus have self extinguishing properties. Especially beneficial is the fact that the IC molding compound based on the new compounds, can withstand higher temperatures required for lead-free soldering. The PWB also contains a limited amount of safe metal hydroxide.</abstract><pub>IEEE</pub><doi>10.1109/ECODIM.2001.992513</doi><tpages>6</tpages></addata></record> |
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identifier | ISBN: 9780769512662 |
ispartof | Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 2001, p.1020-1025 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Additives Application specific integrated circuits Epoxy resins Flame retardants Hazardous materials Insulation Integrated circuit technology National electric code Waste materials Wiring |
title | Development of environmentally friendly epoxy-resin compounds without toxic flame retardants and their application to electronic parts |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T03%3A50%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Development%20of%20environmentally%20friendly%20epoxy-resin%20compounds%20without%20toxic%20flame%20retardants%20and%20their%20application%20to%20electronic%20parts&rft.btitle=Proceedings%20Second%20International%20Symposium%20on%20Environmentally%20Conscious%20Design%20and%20Inverse%20Manufacturing&rft.au=Kiuchi,%20Y.&rft.date=2001&rft.spage=1020&rft.epage=1025&rft.pages=1020-1025&rft.isbn=9780769512662&rft.isbn_list=0769512666&rft_id=info:doi/10.1109/ECODIM.2001.992513&rft_dat=%3Cieee_6IE%3E992513%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=992513&rfr_iscdi=true |