Selective plating of nickel ceramic composite films for MEMS applications

A simple, selective and CMOS-compatible deposition method for nickel ceramic composite films has been demonstrated. Using an electroless plating technique, two types of nickel ceramic composite thin films, nickel-cordierite and nickel-iron (II, III) oxide, have been successfully deposited and charac...

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Bibliographische Detailangaben

Hauptverfasser:	Teh, K.S., Cheng, Y.T., Sambucetti, C.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Ceramics Electric resistance Electronics Exact sciences and technology Iron Micro- and nanoelectromechanical devices (mems/nems) Micromechanical devices Nickel Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductor thin films Silicon Sputtering Thermal expansion Thermal resistance
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