Analogue integrated circuits electrothermal modelling
Recent models of electronic devices included in most popular simulation programs hardly simulate the thermal effects. It is possible only to set the fixed temperature of the entire die to consider the influence of equal temperature on the electric parameters of those devices. In this paper, a simple...
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creator | Bieganski, S. Napieralski, A. |
description | Recent models of electronic devices included in most popular simulation programs hardly simulate the thermal effects. It is possible only to set the fixed temperature of the entire die to consider the influence of equal temperature on the electric parameters of those devices. In this paper, a simple electrothermal modelling technique for analogue bipolar integrated circuits is presented. |
doi_str_mv | 10.1109/CADSM.2001.975787 |
format | Conference Proceeding |
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It is possible only to set the fixed temperature of the entire die to consider the influence of equal temperature on the electric parameters of those devices. In this paper, a simple electrothermal modelling technique for analogue bipolar integrated circuits is presented.</description><identifier>ISBN: 9789665530794</identifier><identifier>ISBN: 9665530798</identifier><identifier>DOI: 10.1109/CADSM.2001.975787</identifier><language>eng</language><publisher>IEEE</publisher><subject>Artificial intelligence ; Bipolar integrated circuits ; Circuit simulation ; Electric potential ; Electrothermal effects ; Impedance ; Integrated circuit modeling ; Resistance heating ; Temperature ; Thermal conductivity</subject><ispartof>Experience of Designing and Applications of CAD Systems in Microelectronics. Proceedings of the VI-th International Conference. CADSM 2001 (IEEE Cat. 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No.01 EX473)</title><addtitle>CADSM</addtitle><description>Recent models of electronic devices included in most popular simulation programs hardly simulate the thermal effects. It is possible only to set the fixed temperature of the entire die to consider the influence of equal temperature on the electric parameters of those devices. In this paper, a simple electrothermal modelling technique for analogue bipolar integrated circuits is presented.</description><subject>Artificial intelligence</subject><subject>Bipolar integrated circuits</subject><subject>Circuit simulation</subject><subject>Electric potential</subject><subject>Electrothermal effects</subject><subject>Impedance</subject><subject>Integrated circuit modeling</subject><subject>Resistance heating</subject><subject>Temperature</subject><subject>Thermal conductivity</subject><isbn>9789665530794</isbn><isbn>9665530798</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2001</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj0tLxDAUhQMiKGN_gK76B1qT3tw8lqW-BkZcqOshydypkT4kzSz89xbGszmLAx_fYexW8FoIbu-79uH9tW44F7XVqI2-YIXVxiqFCFxbecWKZfnma8CC0uqaYTu5Ye5PVMYpU59cpkMZYgqnmJeSBgo5zfmL0uiGcpwPNAxx6m_Y5dENCxX_vWGfT48f3Uu1e3vedu2uikLLXDWAxojGIygFBoxXqwsHQKnFER2SJqW9kasJ0rqRDGRQByU9D94b2LC7MzcS0f4nxdGl3_35G_wB2qRDrw</recordid><startdate>2001</startdate><enddate>2001</enddate><creator>Bieganski, S.</creator><creator>Napieralski, A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>2001</creationdate><title>Analogue integrated circuits electrothermal modelling</title><author>Bieganski, S. ; Napieralski, A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i174t-2358812b53663838b68960335471f5a5e7e67b846765e689e4ce857c64b0cbb83</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Artificial intelligence</topic><topic>Bipolar integrated circuits</topic><topic>Circuit simulation</topic><topic>Electric potential</topic><topic>Electrothermal effects</topic><topic>Impedance</topic><topic>Integrated circuit modeling</topic><topic>Resistance heating</topic><topic>Temperature</topic><topic>Thermal conductivity</topic><toplevel>online_resources</toplevel><creatorcontrib>Bieganski, S.</creatorcontrib><creatorcontrib>Napieralski, A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bieganski, S.</au><au>Napieralski, A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Analogue integrated circuits electrothermal modelling</atitle><btitle>Experience of Designing and Applications of CAD Systems in Microelectronics. Proceedings of the VI-th International Conference. CADSM 2001 (IEEE Cat. No.01 EX473)</btitle><stitle>CADSM</stitle><date>2001</date><risdate>2001</risdate><spage>143</spage><epage>144</epage><pages>143-144</pages><isbn>9789665530794</isbn><isbn>9665530798</isbn><abstract>Recent models of electronic devices included in most popular simulation programs hardly simulate the thermal effects. It is possible only to set the fixed temperature of the entire die to consider the influence of equal temperature on the electric parameters of those devices. In this paper, a simple electrothermal modelling technique for analogue bipolar integrated circuits is presented.</abstract><pub>IEEE</pub><doi>10.1109/CADSM.2001.975787</doi><tpages>2</tpages></addata></record> |
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identifier | ISBN: 9789665530794 |
ispartof | Experience of Designing and Applications of CAD Systems in Microelectronics. Proceedings of the VI-th International Conference. CADSM 2001 (IEEE Cat. No.01 EX473), 2001, p.143-144 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Artificial intelligence Bipolar integrated circuits Circuit simulation Electric potential Electrothermal effects Impedance Integrated circuit modeling Resistance heating Temperature Thermal conductivity |
title | Analogue integrated circuits electrothermal modelling |
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