Reliability of different flex materials in high density flip chip on flex applications

This paper presents the latest results from the reliability tests of high density flip chip on flex application using anisotropically conductive adhesives. Four different types of flexible substrates and two different types of anisotropically conductive adhesives were selected. Both paste and film t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Palm, P., Maattanen, J., De Maquille, Y., Picault, A., Vanfleteren, J., Vandecasteele, B.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Anisotropic conductive films Anisotropic magnetoresistance Conducting materials Conductive adhesives Contact resistance Failure analysis Flip chip Materials reliability Polymer films Testing
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